High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits

Project: Research

Status	Finished
Effective start/end date	15/05/15 → 31/12/20

High power density 4 to 16 GHz non-uniform distributed power amplifier with a novel trifilar
Mahon, S. J., Milner, L. E., Shahid, I., Parker, A. E., Gorman, M. C. & Heimlich, M. C., 2020, Proceedings of the 15th European Microwave Integrated Circuits Conference. Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE), p. 273-276 4 p.
Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review
4 Citations (Scopus)
Real-time, in-circuit temperature sensing of an x-band gan power amplifier
Mahon, S. J., Ell, O., Milner, L. E., Kuxa, E., Parker, A. E., Gorman, M. C. & Heimlich, M. C., 2020, Proceedings of the 15th European Microwave Integrated Circuits Conference. Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE), p. 37-40 4 p.
Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review
3 Citations (Scopus)
Characterisation of GaAs pHEMT transient thermal response
Schwitter, B. K., Parker, A. E., Mahon, S. J. & Heimlich, M. C., 2018, 2018 13th European Microwave Integrated Circuits Conference proceedings. Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE), p. 218-221 4 p.
Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review
4 Citations (Scopus)

Project Details