High performance, optimized chip-scale packaging for millimetre wave and THz integrated circuits

  • Heimlich, Michael (Primary Chief Investigator)
  • Lang, Candace (Chief Investigator)
  • Parker, Tony (Chief Investigator)
  • Downes, James (Chief Investigator)
  • Mahon, Simon (Partner Investigator)
  • Morosin, Renato (Partner Investigator)
  • MQRES (International), MQRES (International) (Student)
  • PhD Contribution (ARC), PhD Contribution (ARC) (Student)

Project: Research

Project Details

StatusActive
Effective start/end date15/05/1531/12/20