2.45 GHz cylindrical dielectric resonator antenna fed by dielectric image line

A. A. Baba, M. A. Zakariya, Z. Baharudin, M. H M Khir, S. M. Ali

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contribution

2 Citations (Scopus)

Abstract

In this paper, the experimental study on cylindrical dielectric resonator antenna (CDRA) with an aperture coupled dielectric image line (DIL) is presented using a CCTO material. The CDRA is fed by a 50ω dielectric image line at a frequency around 2.45 GHz. High permittivity (εr = 55) DIL samples with different heights are employed. The CST microwave studio is used to analyze the different results in term of return loss, bandwidth and radiation pattern. The DIL feeding technique has shown a better directivity for CDRA as compared to microstrip line coupling.

Original languageEnglish
Title of host publicationBEIAC 2013
Subtitle of host publicationProceedings of 2013 IEEE Business Engineering and Industrial Applications Colloquium
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages120-124
Number of pages5
ISBN (Print)9781467359689
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2013 IEEE Business Engineering and Industrial Applications Colloquium, BEIAC 2013 - Langkawi, Malaysia
Duration: 7 Apr 20139 Apr 2013

Other

Other2013 IEEE Business Engineering and Industrial Applications Colloquium, BEIAC 2013
CountryMalaysia
CityLangkawi
Period7/04/139/04/13

Keywords

  • Cylindrical dielectric resonator antenna (CDRA)
  • Dielectric image line (DIL)

Fingerprint Dive into the research topics of '2.45 GHz cylindrical dielectric resonator antenna fed by dielectric image line'. Together they form a unique fingerprint.

  • Cite this

    Baba, A. A., Zakariya, M. A., Baharudin, Z., Khir, M. H. M., & Ali, S. M. (2013). 2.45 GHz cylindrical dielectric resonator antenna fed by dielectric image line. In BEIAC 2013: Proceedings of 2013 IEEE Business Engineering and Industrial Applications Colloquium (pp. 120-124). Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/BEIAC.2013.6560096