A 70 GHz chip to printed circuit board interconnect using Kapton flexible substrate

Shyam G. Mehta, Leigh E. Milner*, Michael E. Parker

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contribution

2 Citations (Scopus)

Abstract

A method of connecting integrated circuits to Printed Circuit Board (PCB) carriers with broadband frequency response is presented using Kapton film as a flexible, interconnecting substrate. Flip chip processing is applied using a simple and effective technique to curve the flexible substrate, accommodating different heights between the chip and PCB. Measurements of a test assembly show a return loss more than 15 dB and insertion loss less than 1.0 dB from DC to 70 GHz.

Original languageEnglish
Title of host publication2016 IEEE 2nd Australian microwave symposium (AMS)
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages9-10
Number of pages2
ISBN (Electronic)9781509004294
DOIs
Publication statusPublished - 2016
Externally publishedYes
EventIEEE Australian Microwave Symposium (AMS) (2nd : 2016) - Adelaide, Australia
Duration: 11 Feb 201612 Feb 2016

Conference

ConferenceIEEE Australian Microwave Symposium (AMS) (2nd : 2016)
CountryAustralia
CityAdelaide
Period11/02/1612/02/16

Keywords

  • Flexible substrates
  • Kapton
  • Coplanar waveguide (CPW)
  • broadband
  • flip chip
  • wire bond

Cite this

Mehta, S. G., Milner, L. E., & Parker, M. E. (2016). A 70 GHz chip to printed circuit board interconnect using Kapton flexible substrate. In 2016 IEEE 2nd Australian microwave symposium (AMS) (pp. 9-10). Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/AUSMS.2016.7593468