A 70 GHz chip to printed circuit board interconnect using Kapton flexible substrate

Shyam G. Mehta; Leigh E. Milner; Michael E. Parker

doi:10.1109/AUSMS.2016.7593468

A 70 GHz chip to printed circuit board interconnect using Kapton flexible substrate

Shyam G. Mehta, Leigh E. Milner^*, Michael E. Parker

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

3 Citations (Scopus)

Abstract

A method of connecting integrated circuits to Printed Circuit Board (PCB) carriers with broadband frequency response is presented using Kapton film as a flexible, interconnecting substrate. Flip chip processing is applied using a simple and effective technique to curve the flexible substrate, accommodating different heights between the chip and PCB. Measurements of a test assembly show a return loss more than 15 dB and insertion loss less than 1.0 dB from DC to 70 GHz.

Original language	English
Title of host publication	2016 IEEE 2nd Australian microwave symposium (AMS)
Place of Publication	Piscataway, NJ
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	9-10
Number of pages	2
ISBN (Electronic)	9781509004294
DOIs	https://doi.org/10.1109/AUSMS.2016.7593468
Publication status	Published - 2016
Externally published	Yes
Event	IEEE Australian Microwave Symposium (AMS) (2nd : 2016) - Adelaide, Australia Duration: 11 Feb 2016 → 12 Feb 2016

Conference

Conference	IEEE Australian Microwave Symposium (AMS) (2nd : 2016)
Country/Territory	Australia
City	Adelaide
Period	11/02/16 → 12/02/16

Keywords

Flexible substrates
Kapton
Coplanar waveguide (CPW)
broadband
flip chip
wire bond

Access to Document

10.1109/AUSMS.2016.7593468

Cite this

@inproceedings{56505413efb14e65916dbac9af49f220,

title = "A 70 GHz chip to printed circuit board interconnect using Kapton flexible substrate",

abstract = "A method of connecting integrated circuits to Printed Circuit Board (PCB) carriers with broadband frequency response is presented using Kapton film as a flexible, interconnecting substrate. Flip chip processing is applied using a simple and effective technique to curve the flexible substrate, accommodating different heights between the chip and PCB. Measurements of a test assembly show a return loss more than 15 dB and insertion loss less than 1.0 dB from DC to 70 GHz.",

keywords = "Flexible substrates, Kapton, Coplanar waveguide (CPW), broadband, flip chip, wire bond",

author = "Mehta, {Shyam G.} and Milner, {Leigh E.} and Parker, {Michael E.}",

year = "2016",

doi = "10.1109/AUSMS.2016.7593468",

language = "English",

pages = "9--10",

booktitle = "2016 IEEE 2nd Australian microwave symposium (AMS)",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

note = "IEEE Australian Microwave Symposium (AMS) (2nd : 2016) ; Conference date: 11-02-2016 Through 12-02-2016",

}

Mehta, SG, Milner, LE & Parker, ME 2016, A 70 GHz chip to printed circuit board interconnect using Kapton flexible substrate. in 2016 IEEE 2nd Australian microwave symposium (AMS). Institute of Electrical and Electronics Engineers (IEEE), Piscataway, NJ, pp. 9-10, IEEE Australian Microwave Symposium (AMS) (2nd : 2016), Adelaide, Australia, 11/02/16. https://doi.org/10.1109/AUSMS.2016.7593468

A 70 GHz chip to printed circuit board interconnect using Kapton flexible substrate. / Mehta, Shyam G.; Milner, Leigh E.; Parker, Michael E.

2016 IEEE 2nd Australian microwave symposium (AMS). Piscataway, NJ : Institute of Electrical and Electronics Engineers (IEEE), 2016. p. 9-10.

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

TY - GEN

T1 - A 70 GHz chip to printed circuit board interconnect using Kapton flexible substrate

AU - Mehta, Shyam G.

AU - Milner, Leigh E.

AU - Parker, Michael E.

PY - 2016

Y1 - 2016

N2 - A method of connecting integrated circuits to Printed Circuit Board (PCB) carriers with broadband frequency response is presented using Kapton film as a flexible, interconnecting substrate. Flip chip processing is applied using a simple and effective technique to curve the flexible substrate, accommodating different heights between the chip and PCB. Measurements of a test assembly show a return loss more than 15 dB and insertion loss less than 1.0 dB from DC to 70 GHz.

AB - A method of connecting integrated circuits to Printed Circuit Board (PCB) carriers with broadband frequency response is presented using Kapton film as a flexible, interconnecting substrate. Flip chip processing is applied using a simple and effective technique to curve the flexible substrate, accommodating different heights between the chip and PCB. Measurements of a test assembly show a return loss more than 15 dB and insertion loss less than 1.0 dB from DC to 70 GHz.

KW - Flexible substrates

KW - Kapton

KW - Coplanar waveguide (CPW)

KW - broadband

KW - flip chip

KW - wire bond

UR - http://www.scopus.com/inward/record.url?scp=84995475188&partnerID=8YFLogxK

U2 - 10.1109/AUSMS.2016.7593468

DO - 10.1109/AUSMS.2016.7593468

M3 - Conference proceeding contribution

SP - 9

EP - 10

BT - 2016 IEEE 2nd Australian microwave symposium (AMS)

PB - Institute of Electrical and Electronics Engineers (IEEE)

CY - Piscataway, NJ

T2 - IEEE Australian Microwave Symposium (AMS) (2nd : 2016)

Y2 - 11 February 2016 through 12 February 2016

ER -

A 70 GHz chip to printed circuit board interconnect using Kapton flexible substrate

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Keywords

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