TY - JOUR
T1 - A comparison of parametric and multivariable optimization techniques in a raised-floor data center
AU - Nagarathinam, Srinarayana
AU - Fakhim, Babak
AU - Behnia, Masud
AU - Armfield, Steve
PY - 2013
Y1 - 2013
N2 - It is well known that the flow distribution in data centers can be effected by a variety of parameters such as rack and computer room air conditioning (CRAC) positions, raised-floor height, ceiling height, and percentage opening of perforated tiles. In the present paper, numerical simulations are conducted to optimize the layout of a raised-floor data center with respect to these parameters. Two different approaches have been used: parametric optimization; and a multivariable approach using response surface optimization. In the parametric optimization procedure, the data center is optimized with respect to the maximum temperature in the room. While in the multivariable approach, a cost function is constructed from all the rack inlet temperatures and is minimized. The results show that the multivariable approach is computationally economical and the optimized layout gives a better thermal performance compared to that of parametric optimization.
AB - It is well known that the flow distribution in data centers can be effected by a variety of parameters such as rack and computer room air conditioning (CRAC) positions, raised-floor height, ceiling height, and percentage opening of perforated tiles. In the present paper, numerical simulations are conducted to optimize the layout of a raised-floor data center with respect to these parameters. Two different approaches have been used: parametric optimization; and a multivariable approach using response surface optimization. In the parametric optimization procedure, the data center is optimized with respect to the maximum temperature in the room. While in the multivariable approach, a cost function is constructed from all the rack inlet temperatures and is minimized. The results show that the multivariable approach is computationally economical and the optimized layout gives a better thermal performance compared to that of parametric optimization.
UR - http://www.scopus.com/inward/record.url?scp=84887575013&partnerID=8YFLogxK
U2 - 10.1115/1.4023214
DO - 10.1115/1.4023214
M3 - Article
VL - 135
SP - 1
EP - 8
JO - Journal of Electronic Packaging, Transactions of the ASME
JF - Journal of Electronic Packaging, Transactions of the ASME
SN - 1043-7398
IS - 3
M1 - 031007
ER -