Abstract
In this work, a design of a transition from a standard D-band waveguide to substrate integrated waveguide (SIW) technology is presented for 6G applications. The waveguide is connected to an SIW by carving a slot at the bottom metal of the printed circuit board (PCB). A pair of vias is added to shift the inband null to a higher frequency, whereas a parasitic patch is used to improve impedance matching. A prototype of a back-to-back SIW transition is fabricated and measured using D-band VNA extenders. The measurement shows a -10 dB impedance bandwidth of 26.5 GHz (135–161.5 GHz) and a 3-dB bandwidth of 28 GHz (133.8–161.8 GHz). The transition can be integrated with a D-band antenna for 6G applications.
| Original language | English |
|---|---|
| Pages (from-to) | 419-426 |
| Number of pages | 8 |
| Journal | Journal of Electromagnetic Engineering and Science |
| Volume | 22 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - Jul 2022 |
Bibliographical note
Copyright the Publisher. Version archived for private and non-commercial use with the permission of the author/s and according to publisher conditions. For further rights please contact the publisher.Keywords
- SIW Technology
- Waveguide-PCB Transition
- 6G Communication
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