A new approach to the design of complex heat transfer systems

notebook-size computer design

M. Nakanishi*, W. Nakayama, M. Behnia, D. Soodphakdee

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contribution

1 Citation (Scopus)

Abstract

A new approach for solving heat-transfer problems in geometrically complex systems has been developed. The purpose of this new approach is to develop a methodology whereby the packaging designers is freed from the task of performing detailed numerical analysis. The approach utilizes templates of components and electric devices rather than working on actual components, without simulation of the detailed complex geometry. By varying the template dimensions, the effects of geometrical configurations on cooling airflow and heat-transfer can be studied systematically. The approach is applicable to heat-transfer analysis of portable computers. Available numerical analysis tools, such as computational fluid dynamics (CFD) codes, are used to create heat-transfer databases from which fast design codes can be developed.

Original languageEnglish
Title of host publicationITHERM 2002
Subtitle of host publication8th intersociety conference on thermal and thermomechanical phenomena in electronic systems
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages595-599
Number of pages5
Volume2002
ISBN (Electronic)0780371526
ISBN (Print)0780371526
DOIs
Publication statusPublished - 2002
Externally publishedYes
Event8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, United States
Duration: 30 May 20021 Jun 2002

Other

Other8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
CountryUnited States
CitySan Diego
Period30/05/021/06/02

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    Nakanishi, M., Nakayama, W., Behnia, M., & Soodphakdee, D. (2002). A new approach to the design of complex heat transfer systems: notebook-size computer design. In ITHERM 2002: 8th intersociety conference on thermal and thermomechanical phenomena in electronic systems (Vol. 2002, pp. 595-599). [1012508] Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/ITHERM.2002.1012508