Abstract
The paper describes a novel approach to solving heat transfer problems in geometrically complex systems. In the present approach, instead of simulating the detailed complex geometry, templates of components and devices are assumed rather than working on actual components. By varying the template dimensions a systematic study on the effects of geometrical configurations on cooling airflow and heat transfer is made possible. The application of the approach is illustrated drawing examples from heat transfer analysis of portable computers. The purpose of the study is to develop a methodology whereby the packaging designer is freed from the task of performing detailed numerical analysis. Currently available numerical analysis tools such as computational fluid dynamics (CFD) codes are given a role in an undertaking to create databases from which fast design codes are developed.
Original language | English |
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Pages (from-to) | 199-206 |
Number of pages | 8 |
Journal | IEEE Transactions on Components and Packaging Technologies |
Volume | 24 |
Issue number | 2 |
DOIs | |
Publication status | Published - Jun 2001 |
Externally published | Yes |
Keywords
- Computational fluid dynamics
- Design productivity
- Electronic cooling
- Portable computer
- Thermal management