Abstract
This paper presents an Integrated on-chip balun design for millimeter-wave applications. The balun is designed and fabricated in a standard silicon-germanium technology. The designed balun is based on a coupled-line structure, which consists of two edge-coupled meander lines along with a solid ground plane. The simulation shows that the proposed balun covers the bandwidth from 30 GHz to above 100 GHz. Within this frequency range, the magnitude error and phase error are 0.3 dB and 4°, respectively. The insertion loss of the balun is better than 5 dB at the center of the band. The size of the balun is only 500 μm × 400 μm, excluding the pads.
Original language | English |
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Title of host publication | Proceedings of the 2016 18th International Conference on Electromagnetics in Advanced Applications, ICEAA 2016 |
Place of Publication | Piscataway, NJ |
Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
Pages | 913-915 |
Number of pages | 3 |
ISBN (Electronic) | 9781467398114 |
DOIs | |
Publication status | Published - 2 Nov 2016 |
Event | 18th International Conference on Electromagnetics in Advanced Applications, ICEAA 2016 - Cairns, Australia Duration: 19 Sept 2016 → 23 Sept 2016 |
Other
Other | 18th International Conference on Electromagnetics in Advanced Applications, ICEAA 2016 |
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Country/Territory | Australia |
City | Cairns |
Period | 19/09/16 → 23/09/16 |