Addressing thermal challenges in design of data centres

Babak Fakhim*, Srinarayana Nagarathinam, Simon Wong, Masud Behnia, Steve Armfield

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contribution

Abstract

Aggregation of small networking hardware has led to an ever increasing power density in data centres. The energy consumption of IT systems is continuing to rise substantially owing to the demands of electronic information and storage requirements. Energy consumption of data centres can be severely and unnecessarily high due to inadequate localised cooling and densely packed rack layouts. However, as heat dissipation in data centres rises by orders of magnitude, inefficiencies such as air recirculation causing hot spots, leading to flow short-circuiting will have a significant impact on the thermal manageability and energy efficiency of the cooling infrastructure. Therefore, the thermal management of high-powered electronic components is a significant challenge for cooling of data centres. In this project, an operational data centre has been studied. Field measurements of temperature have been performed. Numerical analysis of flow and temperature fields is conducted in order to evaluate the thermal behaviour of the data centre. A number of undesirable hot spots have been identified. To rectify the problem, a few practical design solutions to improve the cooling effectiveness have been proposed and examined to ensure a reduced air-conditioning power requirement. Therefore, a better understanding of the cooling issues and the respective proposed solutions can lead to an improved design for future data centres.

Original languageEnglish
Title of host publicationProceedings of the ASME 10th Biennial Conference on Engineering Systems Design and Analysis-2010
Subtitle of host publicationPresented at the 10th Biennial Conference on Engineering Systems Design and Analysis, July 12-24, 2010, Istanbul, Turkey
Place of PublicationNew York
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages219-228
Number of pages10
Volume1
ISBN (Electronic)9780791838778
ISBN (Print)9780791849156
DOIs
Publication statusPublished - 2010
Externally publishedYes
EventASME 2010 10th Biennial Conference on Engineering Systems Design and Analysis, ESDA2010 - Istanbul, Turkey
Duration: 12 Jul 201014 Jul 2010

Other

OtherASME 2010 10th Biennial Conference on Engineering Systems Design and Analysis, ESDA2010
CountryTurkey
CityIstanbul
Period12/07/1014/07/10

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    Fakhim, B., Nagarathinam, S., Wong, S., Behnia, M., & Armfield, S. (2010). Addressing thermal challenges in design of data centres. In Proceedings of the ASME 10th Biennial Conference on Engineering Systems Design and Analysis-2010: Presented at the 10th Biennial Conference on Engineering Systems Design and Analysis, July 12-24, 2010, Istanbul, Turkey (Vol. 1, pp. 219-228). [ESDA2010-24690] New York: American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/ESDA2010-24690