Afterglow ground-state copper density behavior in kinetically enhanced copper vapor lasers

Richard P. Mildren, Michael J. Withford, Daniel J. W. Brown, Robert J. Carman, James A. Piper

Research output: Contribution to journalArticleResearchpeer-review

Abstract

The interferometric "Hook" method has been used to measure the copper ground-state density during the interpulse period for a 38-mm bore diameter copper vapor laser (CVL) operated in kinetically enhanced (KE) mode (Ne-HCl-H 2 gas mixture) and in conventional mode (pure neon and Ne-H 2 gas mixtures). It was found that the rate of regrowth of the axial copper density during the afterglow of the KE-CVL is 3-4 times faster, and the axial prepulse ground-state copper density is 2-3 times higher, than that observed for pure Ne or Ne-H 2 buffer gases. We conclude that the primary action of the HCl + H 2 additives is to increase the interpulse plasma relaxation rate and to increase the threshold copper density beyond which thermal runaway occurs. These effects are primarily responsible for the eletaled pulse rales and increased pulse energies giving improved power scaling characteristics of KE-CVL's.

LanguageEnglish
Pages2275-2278
Number of pages4
JournalIEEE Journal of Quantum Electronics
Volume34
Issue number12
DOIs
Publication statusPublished - Dec 1998

Fingerprint

afterglows
Ground state
Vapors
vapors
Copper
copper
ground state
Lasers
lasers
Gas mixtures
gas mixtures
Neon
hooks
Hooks
pulses
neon
buffers
Plasmas
scaling
cavities

Keywords

  • copper materials/devices
  • density measurement
  • gas lasers
  • spectroscopy

Cite this

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title = "Afterglow ground-state copper density behavior in kinetically enhanced copper vapor lasers",
abstract = "The interferometric {"}Hook{"} method has been used to measure the copper ground-state density during the interpulse period for a 38-mm bore diameter copper vapor laser (CVL) operated in kinetically enhanced (KE) mode (Ne-HCl-H 2 gas mixture) and in conventional mode (pure neon and Ne-H 2 gas mixtures). It was found that the rate of regrowth of the axial copper density during the afterglow of the KE-CVL is 3-4 times faster, and the axial prepulse ground-state copper density is 2-3 times higher, than that observed for pure Ne or Ne-H 2 buffer gases. We conclude that the primary action of the HCl + H 2 additives is to increase the interpulse plasma relaxation rate and to increase the threshold copper density beyond which thermal runaway occurs. These effects are primarily responsible for the eletaled pulse rales and increased pulse energies giving improved power scaling characteristics of KE-CVL's.",
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Afterglow ground-state copper density behavior in kinetically enhanced copper vapor lasers. / Mildren, Richard P.; Withford, Michael J.; Brown, Daniel J. W.; Carman, Robert J.; Piper, James A.

In: IEEE Journal of Quantum Electronics, Vol. 34, No. 12, 12.1998, p. 2275-2278.

Research output: Contribution to journalArticleResearchpeer-review

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T1 - Afterglow ground-state copper density behavior in kinetically enhanced copper vapor lasers

AU - Mildren, Richard P.

AU - Withford, Michael J.

AU - Brown, Daniel J. W.

AU - Carman, Robert J.

AU - Piper, James A.

PY - 1998/12

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