Analysis of 2D via-less artificial magnetic conductors using a cavity model

Yading Li; Karu P. Esselle

Analysis of 2D via-less artificial magnetic conductors using a cavity model

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

2 Downloads (Pure)

Abstract

A rigorous full-wave cavity model is developed for 2D vialess (i.e. uni-planar) metallic periodic structures, which may or may not have a PEC ground plane. This model considers all the homogeneous material blocks in these structures as coupled electromagnetic cavities. This coupled cavity problem is then solved using magnetic vector potential. The via-less artificial magnetic conductor (AMC) surfaces are analyzed using this cavity model and the wave reflection coefficients are calculated for normal incidence case. The results show good agreement with the full-wave HFSS simulation results. To confirm the accuracy of this method, we also compare the electric fields calculated using the cavity model and HFSS.

Original language	English
Title of host publication	Proceedings of the 2006 International Symposium on Antennas and Propagation
Place of Publication	Singapore
Publisher	Research Publishing
Pages	1-5
Number of pages	5
ISBN (Print)	8190317083
Publication status	Published - 2006
Event	International Symposium on Antennas and Propagation - Singapore Duration: 1 Nov 2006 → 4 Nov 2006

Conference

Conference	International Symposium on Antennas and Propagation
City	Singapore
Period	1/11/06 → 4/11/06

Bibliographical note

Copyright IEICE 2006. Originally published as Proceedings of the 2006 International Symposium on Antennas and Propagation, pp. 1-5 (International Symposium on Antennas and Propagation, 1 - 4 November 2006, Singapore). Version archived for private and non-commercial use with the permission of the author/s and according to publisher conditions. For further rights please contact the publisher.

Access to Document

Publisher version (open access)Final published version, 327 KBLicence: Unspecified

Cite this

@inproceedings{eaa4a619c4c849cd9a1589eab05045ef,

title = "Analysis of 2D via-less artificial magnetic conductors using a cavity model",

abstract = "A rigorous full-wave cavity model is developed for 2D vialess (i.e. uni-planar) metallic periodic structures, which may or may not have a PEC ground plane. This model considers all the homogeneous material blocks in these structures as coupled electromagnetic cavities. This coupled cavity problem is then solved using magnetic vector potential. The via-less artificial magnetic conductor (AMC) surfaces are analyzed using this cavity model and the wave reflection coefficients are calculated for normal incidence case. The results show good agreement with the full-wave HFSS simulation results. To confirm the accuracy of this method, we also compare the electric fields calculated using the cavity model and HFSS.",

author = "Yading Li and Esselle, {Karu P.}",

note = "Copyright IEICE 2006. Originally published as Proceedings of the 2006 International Symposium on Antennas and Propagation, pp. 1-5 (International Symposium on Antennas and Propagation, 1 - 4 November 2006, Singapore). Version archived for private and non-commercial use with the permission of the author/s and according to publisher conditions. For further rights please contact the publisher.; International Symposium on Antennas and Propagation ; Conference date: 01-11-2006 Through 04-11-2006",

year = "2006",

language = "English",

isbn = "8190317083",

pages = "1--5",

booktitle = "Proceedings of the 2006 International Symposium on Antennas and Propagation",

publisher = "Research Publishing",

}

TY - GEN

T1 - Analysis of 2D via-less artificial magnetic conductors using a cavity model

AU - Li, Yading

AU - Esselle, Karu P.

N1 - Copyright IEICE 2006. Originally published as Proceedings of the 2006 International Symposium on Antennas and Propagation, pp. 1-5 (International Symposium on Antennas and Propagation, 1 - 4 November 2006, Singapore). Version archived for private and non-commercial use with the permission of the author/s and according to publisher conditions. For further rights please contact the publisher.

PY - 2006

Y1 - 2006

N2 - A rigorous full-wave cavity model is developed for 2D vialess (i.e. uni-planar) metallic periodic structures, which may or may not have a PEC ground plane. This model considers all the homogeneous material blocks in these structures as coupled electromagnetic cavities. This coupled cavity problem is then solved using magnetic vector potential. The via-less artificial magnetic conductor (AMC) surfaces are analyzed using this cavity model and the wave reflection coefficients are calculated for normal incidence case. The results show good agreement with the full-wave HFSS simulation results. To confirm the accuracy of this method, we also compare the electric fields calculated using the cavity model and HFSS.

AB - A rigorous full-wave cavity model is developed for 2D vialess (i.e. uni-planar) metallic periodic structures, which may or may not have a PEC ground plane. This model considers all the homogeneous material blocks in these structures as coupled electromagnetic cavities. This coupled cavity problem is then solved using magnetic vector potential. The via-less artificial magnetic conductor (AMC) surfaces are analyzed using this cavity model and the wave reflection coefficients are calculated for normal incidence case. The results show good agreement with the full-wave HFSS simulation results. To confirm the accuracy of this method, we also compare the electric fields calculated using the cavity model and HFSS.

M3 - Conference proceeding contribution

SN - 8190317083

SP - 1

EP - 5

BT - Proceedings of the 2006 International Symposium on Antennas and Propagation

PB - Research Publishing

CY - Singapore

T2 - International Symposium on Antennas and Propagation

Y2 - 1 November 2006 through 4 November 2006

ER -

Analysis of 2D via-less artificial magnetic conductors using a cavity model

Abstract

Conference

Bibliographical note

Access to Document

Fingerprint

Cite this