Beam alignment with two-stage search for millimeter-wave communications

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Abstract

Swift and accurate alignment of transmitter (Tx) and receiver (Rx) beams is one of the fundamental design challenges to support directional transmission in millimeter-wave cellular communications. In this paper, we propose a new Optimized Two-Stage Search (OTSS) algorithm for Tx-Rx beam alignment via beam training. In contrast to one-shot exhaustive search, OTSS judiciously divides the training energy budget into two stages. In the first stage, OTSS explores and trains all candidate Tx-Rx beam pairs and then discards a set of less favorable pairs learned from the measured received signal. In the second stage, OTSS takes an extra measurement for each of the remaining pairs and combines with the previous measurement to determine the best one. For OTSS, we derive fundamental bounds on its misalignment probability under a single-path channel model with ideal codebooks and establish a guideline on its optimized parameter choices. Numerical results have confirmed the advantage of OTSS over the state-of-the-art baselines.

Original languageEnglish
Title of host publication2019 IEEE International Conference on Communications (ICC)
Subtitle of host publicationproceedings
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages1-6
Number of pages6
ISBN (Electronic)9781538680889
ISBN (Print)9781538680896
DOIs
Publication statusPublished - 2019
Event2019 IEEE International Conference on Communications, ICC 2019 - Shanghai, China
Duration: 20 May 201924 May 2019

Publication series

Name
ISSN (Print)1550-3607
ISSN (Electronic)1938-1883

Conference

Conference2019 IEEE International Conference on Communications, ICC 2019
CountryChina
CityShanghai
Period20/05/1924/05/19

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Cite this

Li, M., Liu, C., Hanly, S. V., Collings, I. B., & Whiting, P. (2019). Beam alignment with two-stage search for millimeter-wave communications. In 2019 IEEE International Conference on Communications (ICC): proceedings (pp. 1-6). Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/ICC.2019.8761195