CFD simulations in the design and evaluation of heat sinks

W. Nakayama*, M. Behnia

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

Abstract

The roles of CFD simulations in the design of heat sinks are discussed drawing two examples, one is the plate-fin array cooled by planar impinging air flow, and the other is the grooved heat transfer surface of a simulated chip cooled by dielectric coolant. In both examples the CFD analysis is performed to clarify the details of coolant flow and heat transfer in narrow channels which are difficult to capture by experimental means. The experiments, which were conducted in parallel with the CFD analyses, provide the benchmarks for the CFD. It is emphasized that, in an endeavor to develop thermal design codes, the CFD simulation and the experiment are complementary to each other.

Original languageEnglish
Title of host publicationApplication of CAE/CAD to Electronic Systems
EditorsY.W. Kwon, D. Davis, H.H. Chung
Place of PublicationNew York
PublisherASME
Pages11-20
Number of pages10
Volume18
Publication statusPublished - 1996
Externally publishedYes
EventProceedings of the 1996 ASME International Mechanical Engineering Congress and Exposition - Atlanta, GA, USA
Duration: 17 Nov 199622 Nov 1996

Other

OtherProceedings of the 1996 ASME International Mechanical Engineering Congress and Exposition
CityAtlanta, GA, USA
Period17/11/9622/11/96

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