CFD simulations of heat transfer from a heated module in an air stream: comparison with experiments and a parametric study

Masud Behnia*, Wataru Nakayama, Jeffrey Wang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

12 Citations (Scopus)

Abstract

In the last decade or so CFD simulations have become more and more widely used in studies of electronic cooling. Validation of these simulations has been considered to be very important. Nakayama and Park have performed a series of experiments with the aim of measuring the heat transfer and flow field in a simple geometry of a heated chip in an air stream. They observed a number of complex features in both the flow field and heat transfer behavior. In this study, their experimental geometry has been used to simulate the flow and temperature fields in a parallel-plate channel with a heated block mounted on the floor. The channel inlet flow velocity has been varied between 1 and 7m/s. Various turbulence models have been tested, and the effect of the channel inlet flow on the heat transfer rate has been determined by considering both a uniform and fully-developed condition. The substrate adiabatic heat transfer coefficient is also numerically determined. The results indicate that the flow in the vicinity of the module is three-dimensional, and exhibits flow separation and vortex formation, hence leading to a complex distribution of the local heat transfer coefficient on the substrate. The air temperature next to the floor is strongly affected by the heat transfer from the block, which leads to the formation of a thermal wake downstream of it. The experimental data is used to validate the CFD predictions and the agreement for some parameters is shown to be favorable.

Original languageEnglish
Title of host publicationThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
EditorsSushi1 H. Bhavnani, Gary B. Kromann, Douglas J. Nelson
Place of PublicationPiscataway, N.J.
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages143-151
Number of pages9
ISBN (Electronic)0780344774
ISBN (Print)0780344758, 0780344766
DOIs
Publication statusPublished - May 1998
Externally publishedYes
EventProceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM - Seattle, WA, USA
Duration: 27 May 199830 May 1998

Other

OtherProceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
CitySeattle, WA, USA
Period27/05/9830/05/98

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