Comparison of heat sink geometries for laminar forced convection: numerical simulation of periodically developed flow

Masud Behnia; David Copeland; Denpong Soodphakdee

doi:10.1109/ITHERM.1998.689579

Comparison of heat sink geometries for laminar forced convection: numerical simulation of periodically developed flow

Masud Behnia^*, David Copeland, Denpong Soodphakdee

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

46 Citations (Scopus)

Abstract

In this study we have attempted to compare the heat transfer performance of various commonly used fin geometries. Realistic, manufacturable geometries are optimized for minimizing thermal resistance at moderate laminar air velocities. The basis of comparison was chosen to be a circular array of 1mm diameter pin fins with a 2mm pitch. The pitch-to-width ratio of the other geometries were chosen to provide equal ratios of fin area to base area. CFD simulations were carried out on a two-dimensional computational domain bounded by planes of symmetry parallel to the flow. The air velocity was in the range of 0.5 to 5m/s. A comparison of heat transfer coefficient and pressure drop is presented.

Original language	English
Title of host publication	Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
Editors	Sushi1 H. Bhavnani, Gary B. Kromann, Douglas J. Nelson
Place of Publication	Piscataway, N.J.
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	310-315
Number of pages	6
ISBN (Electronic)	0780344774
ISBN (Print)	0780344758, 0780344766
DOIs	https://doi.org/10.1109/ITHERM.1998.689579
Publication status	Published - May 1998
Externally published	Yes
Event	Proceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM - Seattle, WA, USA Duration: 27 May 1998 → 30 May 1998

Other

Other	Proceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
City	Seattle, WA, USA
Period	27/05/98 → 30/05/98

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10.1109/ITHERM.1998.689579

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Behnia, M., Copeland, D., & Soodphakdee, D. (1998). Comparison of heat sink geometries for laminar forced convection: numerical simulation of periodically developed flow. In S. H. Bhavnani, G. B. Kromann, & D. J. Nelson (Eds.), Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference (pp. 310-315). Article 689579 Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/ITHERM.1998.689579

Behnia, Masud ; Copeland, David ; Soodphakdee, Denpong. / Comparison of heat sink geometries for laminar forced convection : numerical simulation of periodically developed flow. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. editor / Sushi1 H. Bhavnani ; Gary B. Kromann ; Douglas J. Nelson. Piscataway, N.J. : Institute of Electrical and Electronics Engineers (IEEE), 1998. pp. 310-315

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title = "Comparison of heat sink geometries for laminar forced convection: numerical simulation of periodically developed flow",

abstract = "In this study we have attempted to compare the heat transfer performance of various commonly used fin geometries. Realistic, manufacturable geometries are optimized for minimizing thermal resistance at moderate laminar air velocities. The basis of comparison was chosen to be a circular array of 1mm diameter pin fins with a 2mm pitch. The pitch-to-width ratio of the other geometries were chosen to provide equal ratios of fin area to base area. CFD simulations were carried out on a two-dimensional computational domain bounded by planes of symmetry parallel to the flow. The air velocity was in the range of 0.5 to 5m/s. A comparison of heat transfer coefficient and pressure drop is presented.",

author = "Masud Behnia and David Copeland and Denpong Soodphakdee",

year = "1998",

month = may,

doi = "10.1109/ITHERM.1998.689579",

language = "English",

isbn = "0780344758",

pages = "310--315",

editor = "Bhavnani, {Sushi1 H.} and Kromann, {Gary B.} and Nelson, {Douglas J.}",

booktitle = "Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

note = "Proceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM ; Conference date: 27-05-1998 Through 30-05-1998",

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Behnia, M, Copeland, D & Soodphakdee, D 1998, Comparison of heat sink geometries for laminar forced convection: numerical simulation of periodically developed flow. in SH Bhavnani, GB Kromann & DJ Nelson (eds), Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference., 689579, Institute of Electrical and Electronics Engineers (IEEE), Piscataway, N.J., pp. 310-315, Proceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, Seattle, WA, USA, 27/05/98. https://doi.org/10.1109/ITHERM.1998.689579

Comparison of heat sink geometries for laminar forced convection: numerical simulation of periodically developed flow. / Behnia, Masud; Copeland, David; Soodphakdee, Denpong.
Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. ed. / Sushi1 H. Bhavnani; Gary B. Kromann; Douglas J. Nelson. Piscataway, N.J.: Institute of Electrical and Electronics Engineers (IEEE), 1998. p. 310-315 689579.

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

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N2 - In this study we have attempted to compare the heat transfer performance of various commonly used fin geometries. Realistic, manufacturable geometries are optimized for minimizing thermal resistance at moderate laminar air velocities. The basis of comparison was chosen to be a circular array of 1mm diameter pin fins with a 2mm pitch. The pitch-to-width ratio of the other geometries were chosen to provide equal ratios of fin area to base area. CFD simulations were carried out on a two-dimensional computational domain bounded by planes of symmetry parallel to the flow. The air velocity was in the range of 0.5 to 5m/s. A comparison of heat transfer coefficient and pressure drop is presented.

AB - In this study we have attempted to compare the heat transfer performance of various commonly used fin geometries. Realistic, manufacturable geometries are optimized for minimizing thermal resistance at moderate laminar air velocities. The basis of comparison was chosen to be a circular array of 1mm diameter pin fins with a 2mm pitch. The pitch-to-width ratio of the other geometries were chosen to provide equal ratios of fin area to base area. CFD simulations were carried out on a two-dimensional computational domain bounded by planes of symmetry parallel to the flow. The air velocity was in the range of 0.5 to 5m/s. A comparison of heat transfer coefficient and pressure drop is presented.

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DO - 10.1109/ITHERM.1998.689579

M3 - Conference proceeding contribution

AN - SCOPUS:0031643875

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SN - 0780344766

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BT - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

A2 - Bhavnani, Sushi1 H.

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PB - Institute of Electrical and Electronics Engineers (IEEE)

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Behnia M, Copeland D, Soodphakdee D. Comparison of heat sink geometries for laminar forced convection: numerical simulation of periodically developed flow. In Bhavnani SH, Kromann GB, Nelson DJ, editors, Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. Piscataway, N.J.: Institute of Electrical and Electronics Engineers (IEEE). 1998. p. 310-315. 689579 doi: 10.1109/ITHERM.1998.689579

Comparison of heat sink geometries for laminar forced convection: numerical simulation of periodically developed flow

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