Comparison of heat sink geometries for laminar forced convection: numerical simulation of periodically developed flow

Masud Behnia*, David Copeland, Denpong Soodphakdee

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

39 Citations (Scopus)

Abstract

In this study we have attempted to compare the heat transfer performance of various commonly used fin geometries. Realistic, manufacturable geometries are optimized for minimizing thermal resistance at moderate laminar air velocities. The basis of comparison was chosen to be a circular array of 1mm diameter pin fins with a 2mm pitch. The pitch-to-width ratio of the other geometries were chosen to provide equal ratios of fin area to base area. CFD simulations were carried out on a two-dimensional computational domain bounded by planes of symmetry parallel to the flow. The air velocity was in the range of 0.5 to 5m/s. A comparison of heat transfer coefficient and pressure drop is presented.

Original languageEnglish
Title of host publicationThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
EditorsSushi1 H. Bhavnani, Gary B. Kromann, Douglas J. Nelson
Place of PublicationPiscataway, N.J.
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages310-315
Number of pages6
ISBN (Electronic)0780344774
ISBN (Print)0780344758, 0780344766
DOIs
Publication statusPublished - May 1998
Externally publishedYes
EventProceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM - Seattle, WA, USA
Duration: 27 May 199830 May 1998

Other

OtherProceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
CitySeattle, WA, USA
Period27/05/9830/05/98

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