Cooling problems and thermal issues in high power electronics - A multi faceted design approach

Masud Behnia*, Luke Maguire, Graham Morrison

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

11 Citations (Scopus)

Abstract

This paper provides a review of some of the issues currently facing thermal designers of high power electronics. With the current market resistance to widely embrace advanced methods such as liquid cooling, air cooling will continue to be a popular choice. As heat loads increase and system sizes reduce, ther innovation and optimisation of system level air cooling design will need to continue. Selected case studies are presented to illustrate the range of design tools currently available and to highlight the need for an integrated approach to meet future cooling demands.

Original languageEnglish
Title of host publicationProceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
EditorsL.J. Ernst, G.Q. Zhang, P. Rodgers, O. Saint Leger
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages519-526
Number of pages8
ISBN (Print)0780384202
Publication statusPublished - 2004
Externally publishedYes
EventProceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004 - Brussels, Belgium
Duration: 10 May 200412 May 2004

Other

OtherProceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
CountryBelgium
CityBrussels
Period10/05/0412/05/04

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