Cooling problems and thermal issues in high power electronics - A multi faceted design approach

Masud Behnia; Luke Maguire; Graham Morrison

Cooling problems and thermal issues in high power electronics - A multi faceted design approach

Masud Behnia^*, Luke Maguire, Graham Morrison

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

11 Citations (Scopus)

Abstract

This paper provides a review of some of the issues currently facing thermal designers of high power electronics. With the current market resistance to widely embrace advanced methods such as liquid cooling, air cooling will continue to be a popular choice. As heat loads increase and system sizes reduce, ther innovation and optimisation of system level air cooling design will need to continue. Selected case studies are presented to illustrate the range of design tools currently available and to highlight the need for an integrated approach to meet future cooling demands.

Original language	English
Title of host publication	Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
Editors	L.J. Ernst, G.Q. Zhang, P. Rodgers, O. Saint Leger
Place of Publication	Piscataway, NJ
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	519-526
Number of pages	8
ISBN (Print)	0780384202
Publication status	Published - 2004
Externally published	Yes
Event	Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004 - Brussels, Belgium Duration: 10 May 2004 → 12 May 2004

Other

Other	Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
Country/Territory	Belgium
City	Brussels
Period	10/05/04 → 12/05/04

Cite this

Behnia, M., Maguire, L., & Morrison, G. (2004). Cooling problems and thermal issues in high power electronics - A multi faceted design approach. In L. J. Ernst, G. Q. Zhang, P. Rodgers, & O. Saint Leger (Eds.), Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004 (pp. 519-526). Institute of Electrical and Electronics Engineers (IEEE).

Behnia, Masud ; Maguire, Luke ; Morrison, Graham. / Cooling problems and thermal issues in high power electronics - A multi faceted design approach. Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004. editor / L.J. Ernst ; G.Q. Zhang ; P. Rodgers ; O. Saint Leger. Piscataway, NJ : Institute of Electrical and Electronics Engineers (IEEE), 2004. pp. 519-526

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title = "Cooling problems and thermal issues in high power electronics - A multi faceted design approach",

abstract = "This paper provides a review of some of the issues currently facing thermal designers of high power electronics. With the current market resistance to widely embrace advanced methods such as liquid cooling, air cooling will continue to be a popular choice. As heat loads increase and system sizes reduce, ther innovation and optimisation of system level air cooling design will need to continue. Selected case studies are presented to illustrate the range of design tools currently available and to highlight the need for an integrated approach to meet future cooling demands.",

author = "Masud Behnia and Luke Maguire and Graham Morrison",

year = "2004",

language = "English",

isbn = "0780384202",

pages = "519--526",

editor = "L.J. Ernst and G.Q. Zhang and P. Rodgers and \{Saint Leger\}, O.",

booktitle = "Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

note = "Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004 ; Conference date: 10-05-2004 Through 12-05-2004",

}

Behnia, M, Maguire, L & Morrison, G 2004, Cooling problems and thermal issues in high power electronics - A multi faceted design approach. in LJ Ernst, GQ Zhang, P Rodgers & O Saint Leger (eds), Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004. Institute of Electrical and Electronics Engineers (IEEE), Piscataway, NJ, pp. 519-526, Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004, Brussels, Belgium, 10/05/04.

Cooling problems and thermal issues in high power electronics - A multi faceted design approach. / Behnia, Masud; Maguire, Luke; Morrison, Graham.
Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004. ed. / L.J. Ernst; G.Q. Zhang; P. Rodgers; O. Saint Leger. Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE), 2004. p. 519-526.

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

TY - GEN

T1 - Cooling problems and thermal issues in high power electronics - A multi faceted design approach

AU - Behnia, Masud

AU - Maguire, Luke

AU - Morrison, Graham

PY - 2004

Y1 - 2004

N2 - This paper provides a review of some of the issues currently facing thermal designers of high power electronics. With the current market resistance to widely embrace advanced methods such as liquid cooling, air cooling will continue to be a popular choice. As heat loads increase and system sizes reduce, ther innovation and optimisation of system level air cooling design will need to continue. Selected case studies are presented to illustrate the range of design tools currently available and to highlight the need for an integrated approach to meet future cooling demands.

AB - This paper provides a review of some of the issues currently facing thermal designers of high power electronics. With the current market resistance to widely embrace advanced methods such as liquid cooling, air cooling will continue to be a popular choice. As heat loads increase and system sizes reduce, ther innovation and optimisation of system level air cooling design will need to continue. Selected case studies are presented to illustrate the range of design tools currently available and to highlight the need for an integrated approach to meet future cooling demands.

UR - https://www.scopus.com/pages/publications/3843057908

M3 - Conference proceeding contribution

AN - SCOPUS:3843057908

SN - 0780384202

SP - 519

EP - 526

BT - Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

A2 - Ernst, L.J.

A2 - Zhang, G.Q.

A2 - Rodgers, P.

A2 - Saint Leger, O.

PB - Institute of Electrical and Electronics Engineers (IEEE)

CY - Piscataway, NJ

T2 - Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Y2 - 10 May 2004 through 12 May 2004

ER -

Behnia M, Maguire L, Morrison G. Cooling problems and thermal issues in high power electronics - A multi faceted design approach. In Ernst LJ, Zhang GQ, Rodgers P, Saint Leger O, editors, Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004. Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE). 2004. p. 519-526

Cooling problems and thermal issues in high power electronics - A multi faceted design approach

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