Dehydroxylation of UV fused silica slides via UV laser irradiation

A. J. Fernandes, D. M. Kane, B. Gong, R. N. Lamb

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

5 Citations (Scopus)
43 Downloads (Pure)

Abstract

Further advances have been made in the development and understanding of an ultraviolet (UV) laser treatment of fused silica glass. Hydroxyl groups present on the surface can be removed by the treatment. The surface hydroxyl groups affect the surface adhesion [1] and performance of silica in catalysis, chromatography, photonics and microelectronics [2, 3]. This work shows that dehydroxylation via laser irradiation is a thermal process. An analysis technique using mass spectrometry has been developed to elucidate and avoid the effect of hydrocarbon contamination, allowing systematic measurements of dehydroxylation to be performed.

Original languageEnglish
Title of host publication2002 Conference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2002 - Proceedings
EditorsMichael Gal
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages433-436
Number of pages4
ISBN (Print)0780375718
DOIs
Publication statusPublished - 2002
EventConference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2002 - Sydney, Australia
Duration: 11 Dec 200213 Dec 2002

Other

OtherConference on Optoelectronic and Microelectronic Materials and Devices, COMMAD 2002
Country/TerritoryAustralia
CitySydney
Period11/12/0213/12/02

Bibliographical note

Copyright 2003 IEEE. Reprinted from Proceedings of the 2002 conference on optoelectronic and microelectronic materials and devices. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Macquarie University’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to [email protected]. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

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