Abstract
Numerical study of a high impedance surface built in microstrip technology by using periodically arranged elliptical patches, grounded through one to four vias is presented. The effect of the variation of the number of vias manifests in different manner on the electromagnetic band gap aperture and position, as results from the parametric study in function of the patch dimensions and diameters of the vias. We show that stop bands cover a frequency range with limits in a ratio of 2.48:1. The results are useful in the design of high impedance surfaces for various applications.
Original language | English |
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Title of host publication | 2010 8th International Conference on Communications (COMM 2010) |
Place of Publication | Piscataway, NJ |
Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
Pages | 239-242 |
Number of pages | 4 |
ISBN (Electronic) | 9781424463633, 9781424463626 |
ISBN (Print) | 9781424463602 |
DOIs | |
Publication status | Published - 2010 |
Event | 8th International Conference on Communications, COMM 2010 - Bucharest Duration: 10 Jun 2010 → 12 Jun 2010 |
Other
Other | 8th International Conference on Communications, COMM 2010 |
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City | Bucharest |
Period | 10/06/10 → 12/06/10 |