Development of a novel planar mesh type micro-magnetic sensor for the quality inspection of electroplated materials

S. C. Mukhopadhyay*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

3 Citations (Scopus)

Abstract

The development work of a novel planar mesh type micro-magnetic sensor for the quality inspection of electroplated materials has been reported in this paper. The sensor has the possibility of inspecting the quality of electroplated materials. The results obtained from the analytical model for the calculation of transfer impedance of the sensor has been discussed. The transfer impedance is used for the quality inspection of electroplated materials in an indirect way. The experimental results are reported which confirm the validity of the analytical model.

Original languageEnglish
Title of host publicationProceedings of IEEE Sensors 2002
Subtitle of host publicationthe first IEEE international conference on sensors
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages741-746
Number of pages6
Volume1
Edition2
Publication statusPublished - 2002
Externally publishedYes
EventFirst IEEE International Conference on Sensors - IEEE Sensors 2002 - Orlando, FL, United States
Duration: 12 Jun 200214 Jun 2002

Other

OtherFirst IEEE International Conference on Sensors - IEEE Sensors 2002
Country/TerritoryUnited States
CityOrlando, FL
Period12/06/0214/06/02

Keywords

  • Electroplated material
  • Meander and mesh configuration
  • Nondestructive evaluation technique
  • Planar type sensors
  • Transfer impedance

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