Development of silicon microelectrodes for cochlear implant technology

Joanna R. Parker*, H. Barry Harrison, Graeme M. Clark, Jim Patrick, Olaf Reinhold

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

    Abstract

    Silicon fabrication technology is being explored as a possible solution to the manufacturing of advanced cochlear implant electrode arrays. Silicon probes have been produced with thickness of 5 μm and coated in Parylene polymer to provide strength. To enable handling they are given a backing of silicone rubber before surgical use. This paper presents some techniques used to produce such silicon microelectrodes.

    Original languageEnglish
    Title of host publicationConference on Optoelectronic & Microelectronic Materials and Devices, Proceedings, COMMAD
    Place of PublicationPiscataway, NJ
    PublisherInstitute of Electrical and Electronics Engineers (IEEE)
    Pages12-15
    Number of pages4
    Publication statusPublished - 1996
    EventProceedings of the 1996 Conference on Optoelectronic & Microelectronic Materials and Devices, COMMAD - Canberra, Aust
    Duration: 8 Dec 199611 Dec 1996

    Other

    OtherProceedings of the 1996 Conference on Optoelectronic & Microelectronic Materials and Devices, COMMAD
    CityCanberra, Aust
    Period8/12/9611/12/96

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