Diode laser activated protein solder for sutureless microsurgical repair of blood vessels

Rodney Trickett*, Peter Maitz, Peter Dekker, Judith Dawes, James Piper, Marco Lanzetta, Earl Owen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contribution

Abstract

A new sutureless technique was developed to repair small blood vessels. The effectiveness of this technique was demonstrated using rat abdominal aorta as a model allowing surgery time, and recovery over a six week period. A comparison was also made with the conventional microsuture repair for further validation of the technique.

Original languageEnglish
Title of host publicationConference on Lasers and Electro-Optics Europe - Technical Digest
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages341
Number of pages1
ISBN (Print)078034233X
DOIs
Publication statusPublished - 1998
EventProceedings of the 1998 International Symposium on Information Theory, CLEO/EUROPE'98 - Glasgow, Scotland
Duration: 14 Sep 199818 Sep 1998

Other

OtherProceedings of the 1998 International Symposium on Information Theory, CLEO/EUROPE'98
CityGlasgow, Scotland
Period14/09/9818/09/98

Fingerprint Dive into the research topics of 'Diode laser activated protein solder for sutureless microsurgical repair of blood vessels'. Together they form a unique fingerprint.

  • Cite this

    Trickett, R., Maitz, P., Dekker, P., Dawes, J., Piper, J., Lanzetta, M., & Owen, E. (1998). Diode laser activated protein solder for sutureless microsurgical repair of blood vessels. In Conference on Lasers and Electro-Optics Europe - Technical Digest (pp. 341). Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/CLEOE.1998.719526