Dispersion model for suspended microstrip line

A. K. Verma; Raj Kumar

doi:10.1109/EPEP.1996.564776

Dispersion model for suspended microstrip line

A. K. Verma^*, Raj Kumar

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

Abstract

A dispersion model for suspended microstrip line is presented in the range of 0.6≤W/h≤10, 1.05≤ε_r(2)≤12.95 and f≤100 GHz. This model provides the rms deviation within 1% against the results of SDA. The model is based on the concept of virtual permittivity and Single Layer Reduction (SLR) formalism.

Original language	English
Title of host publication	Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging
Place of Publication	Piscataway, N.J.
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	52-54
Number of pages	3
ISBN (Print)	0780335147
DOIs	https://doi.org/10.1109/EPEP.1996.564776
Publication status	Published - Oct 1996
Externally published	Yes
Event	Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging - Napa Valley, CA, USA Duration: 28 Oct 1996 → 30 Oct 1996

Other

Other	Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging
City	Napa Valley, CA, USA
Period	28/10/96 → 30/10/96

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10.1109/EPEP.1996.564776

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@inproceedings{d049e46d55ef413693d92a5c315e3314,

title = "Dispersion model for suspended microstrip line",

abstract = "A dispersion model for suspended microstrip line is presented in the range of 0.6≤W/h≤10, 1.05≤εr(2)≤12.95 and f≤100 GHz. This model provides the rms deviation within 1% against the results of SDA. The model is based on the concept of virtual permittivity and Single Layer Reduction (SLR) formalism.",

author = "Verma, {A. K.} and Raj Kumar",

year = "1996",

month = oct,

doi = "10.1109/EPEP.1996.564776",

language = "English",

isbn = "0780335147",

pages = "52--54",

booktitle = "Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

note = "Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging ; Conference date: 28-10-1996 Through 30-10-1996",

}

Verma, AK & Kumar, R 1996, Dispersion model for suspended microstrip line. in Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging. Institute of Electrical and Electronics Engineers (IEEE), Piscataway, N.J., pp. 52-54, Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging, Napa Valley, CA, USA, 28/10/96. https://doi.org/10.1109/EPEP.1996.564776

Dispersion model for suspended microstrip line. / Verma, A. K.; Kumar, Raj.

Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging. Piscataway, N.J. : Institute of Electrical and Electronics Engineers (IEEE), 1996. p. 52-54.

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

TY - GEN

T1 - Dispersion model for suspended microstrip line

AU - Verma, A. K.

AU - Kumar, Raj

PY - 1996/10

Y1 - 1996/10

N2 - A dispersion model for suspended microstrip line is presented in the range of 0.6≤W/h≤10, 1.05≤εr(2)≤12.95 and f≤100 GHz. This model provides the rms deviation within 1% against the results of SDA. The model is based on the concept of virtual permittivity and Single Layer Reduction (SLR) formalism.

AB - A dispersion model for suspended microstrip line is presented in the range of 0.6≤W/h≤10, 1.05≤εr(2)≤12.95 and f≤100 GHz. This model provides the rms deviation within 1% against the results of SDA. The model is based on the concept of virtual permittivity and Single Layer Reduction (SLR) formalism.

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U2 - 10.1109/EPEP.1996.564776

DO - 10.1109/EPEP.1996.564776

M3 - Conference proceeding contribution

AN - SCOPUS:0030399533

SN - 0780335147

SP - 52

EP - 54

BT - Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging

PB - Institute of Electrical and Electronics Engineers (IEEE)

CY - Piscataway, N.J.

T2 - Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging

Y2 - 28 October 1996 through 30 October 1996

ER -

Dispersion model for suspended microstrip line

Abstract

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