Dual-laser integrated microwave imaging system for nondestructive testing of construction materials and structures

Paritosh Giri, Sergey Kharkovsky

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)

Abstract

Microwave near-field imaging techniques have been successfully used for the nondestructive testing of construction materials in civil infrastructures. In this technique, the distance between the microwave antenna and the material, which is referred to as standoff distance is an important parameter. The standoff distance should be kept constant during the scanning process or there should be a proper compensation method to overcome any change in the distance. The undesired change in the standoff distance may mask the indication of flaws. However, civil infrastructures are composed of construction materials with different geometrical shapes and sharp edges, and maintaining the constant standoff distance during the scanning process is a challenging task. For this purpose, a novel dual-laser integrated microwave imaging system is proposed. The proposed system consists of a novel integrated sensing unit with two laser displacement sensors and a single microwave antenna that automatically follows the contour of the material under test at a constant standoff distance and generates microwave images. The proposed system performs contour following at hardware level and does not require any calibration or complex compensation algorithm. The comparison of two microwave antennas is performed to find the suitable antenna for different materials. The proof of concept of the developed system for the nondestructive testing of construction materials with different geometrical shapes is provided.
Original languageEnglish
Pages (from-to)1329-1337
Number of pages9
JournalIEEE Transactions on Instrumentation and Measurement
Volume67
Issue number6
DOIs
Publication statusPublished - Jun 2018
Externally publishedYes

Keywords

  • Construction materials
  • cracks
  • integrated sensing unit (ISU)
  • integrated system
  • laser displacement sensor (LDS)
  • microwave imaging
  • nondestructive testing

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