Effect of redundant sub-module utilization on modular multilevel converters

Georgios S. Konstantinou, Mihai Ciobotaru, Vassilios G. Agelidis

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contribution

31 Citations (Scopus)

Abstract

This paper discusses the operation of the modular multilevel converter (MMC) when redundant switching sub-modules are utilized within the arms of the converter. The redundant switching sub-modules in the arm are not used in order to achieve a higher number of levels at the output of the converter, but to improve the reliability of the topology and reduce the switching frequency of the individual components. Moreover, the use of the redundant switching sub-modules leads to lower second order harmonics in the leg circulating currents and reduced switching frequency in the sub-modules while avoiding consecutive switchings of the same sub-module. Simulation results of a 21-level MMC using configurations with 20, 22 and 24 sub-modules per arm are presented.
Original languageEnglish
Title of host publication2012 IEEE International Conference on Industrial Technology
Subtitle of host publicationProceedings
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages815-820
Number of pages6
ISBN (Electronic)9781467303422
ISBN (Print)9781467303408
DOIs
Publication statusPublished - 2012
Externally publishedYes
Event2012 IEEE International Conference on Industrial Technology, ICIT 2012 - Athens, Greece
Duration: 19 Mar 201221 Mar 2012

Conference

Conference2012 IEEE International Conference on Industrial Technology, ICIT 2012
CountryGreece
CityAthens
Period19/03/1221/03/12

Keywords

  • modular multilevel converter
  • Multilevel converters
  • redundant sub-modules
  • voltage source converter

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  • Cite this

    Konstantinou, G. S., Ciobotaru, M., & Agelidis, V. G. (2012). Effect of redundant sub-module utilization on modular multilevel converters. In 2012 IEEE International Conference on Industrial Technology : Proceedings (pp. 815-820). Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/ICIT.2012.6210039