Electronic packaging education through Internet: A plan at Tohoku university and some challenges in sight

Ryuzo Watanabe; Wataru Nakayama; Masaru Ishizuka; Shigenao Maruyama; Masud Behnia

doi:10.1115/IPACK2003-35333

Electronic packaging education through Internet: A plan at Tohoku university and some challenges in sight

Ryuzo Watanabe^*, Wataru Nakayama, Masaru Ishizuka, Shigenao Maruyama, Masud Behnia

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

Abstract

In April 2002, Tohoku University, Sendai, Japan, started offering educational programs from the cross-department Internet School of Tohoku University (ISTU). Electronic packaging is one of the pillar subjects of ISTU. The present paper summarizes its curriculum of internet-based electronic packaging education. Following the overall description, the curriculum concerning thermal management of electronic equipment is explained in some detail. The ISTU program is still under development, and some challenges are foreseen. The most visible among them is the need to lower the cost of wide bandwidth communications. The future of internet schooling is discussed.

Original language	English
Title of host publication	ASME 2003 International Electronic Packaging Technical Conference and Exhibition
Place of Publication	New York, NY
Publisher	American Society of Mechanical Engineers (ASME)
Pages	7-10
Number of pages	4
Volume	1
ISBN (Electronic)	0791836746
ISBN (Print)	0791836908
DOIs	https://doi.org/10.1115/IPACK2003-35333
Publication status	Published - Jul 2003
Externally published	Yes
Event	2003 International Electronic Packaging Technical Conference and Exhibition - Maui, United States Duration: 6 Jul 2003 → 11 Jul 2003

Other

Other	2003 International Electronic Packaging Technical Conference and Exhibition
Country/Territory	United States
City	Maui
Period	6/07/03 → 11/07/03

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10.1115/IPACK2003-35333

Cite this

Watanabe, R., Nakayama, W., Ishizuka, M., Maruyama, S., & Behnia, M. (2003). Electronic packaging education through Internet: A plan at Tohoku university and some challenges in sight. In ASME 2003 International Electronic Packaging Technical Conference and Exhibition (Vol. 1, pp. 7-10). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IPACK2003-35333

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title = "Electronic packaging education through Internet: A plan at Tohoku university and some challenges in sight",

abstract = "In April 2002, Tohoku University, Sendai, Japan, started offering educational programs from the cross-department Internet School of Tohoku University (ISTU). Electronic packaging is one of the pillar subjects of ISTU. The present paper summarizes its curriculum of internet-based electronic packaging education. Following the overall description, the curriculum concerning thermal management of electronic equipment is explained in some detail. The ISTU program is still under development, and some challenges are foreseen. The most visible among them is the need to lower the cost of wide bandwidth communications. The future of internet schooling is discussed.",

author = "Ryuzo Watanabe and Wataru Nakayama and Masaru Ishizuka and Shigenao Maruyama and Masud Behnia",

year = "2003",

month = jul,

doi = "10.1115/IPACK2003-35333",

language = "English",

isbn = "0791836908",

volume = "1",

pages = "7--10",

booktitle = "ASME 2003 International Electronic Packaging Technical Conference and Exhibition",

publisher = "American Society of Mechanical Engineers (ASME)",

note = "2003 International Electronic Packaging Technical Conference and Exhibition ; Conference date: 06-07-2003 Through 11-07-2003",

}

Watanabe, R, Nakayama, W, Ishizuka, M, Maruyama, S & Behnia, M 2003, Electronic packaging education through Internet: A plan at Tohoku university and some challenges in sight. in ASME 2003 International Electronic Packaging Technical Conference and Exhibition. vol. 1, American Society of Mechanical Engineers (ASME), New York, NY, pp. 7-10, 2003 International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, United States, 6/07/03. https://doi.org/10.1115/IPACK2003-35333

Electronic packaging education through Internet : A plan at Tohoku university and some challenges in sight. / Watanabe, Ryuzo; Nakayama, Wataru; Ishizuka, Masaru; Maruyama, Shigenao; Behnia, Masud.

ASME 2003 International Electronic Packaging Technical Conference and Exhibition. Vol. 1 New York, NY : American Society of Mechanical Engineers (ASME), 2003. p. 7-10.

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

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AU - Behnia, Masud

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AB - In April 2002, Tohoku University, Sendai, Japan, started offering educational programs from the cross-department Internet School of Tohoku University (ISTU). Electronic packaging is one of the pillar subjects of ISTU. The present paper summarizes its curriculum of internet-based electronic packaging education. Following the overall description, the curriculum concerning thermal management of electronic equipment is explained in some detail. The ISTU program is still under development, and some challenges are foreseen. The most visible among them is the need to lower the cost of wide bandwidth communications. The future of internet schooling is discussed.

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Watanabe R, Nakayama W, Ishizuka M, Maruyama S, Behnia M. Electronic packaging education through Internet: A plan at Tohoku university and some challenges in sight. In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. Vol. 1. New York, NY: American Society of Mechanical Engineers (ASME). 2003. p. 7-10 https://doi.org/10.1115/IPACK2003-35333

Electronic packaging education through Internet: A plan at Tohoku university and some challenges in sight

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