Electronic packaging education through Internet: A plan at Tohoku university and some challenges in sight

Ryuzo Watanabe*, Wataru Nakayama, Masaru Ishizuka, Shigenao Maruyama, Masud Behnia

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

Abstract

In April 2002, Tohoku University, Sendai, Japan, started offering educational programs from the cross-department Internet School of Tohoku University (ISTU). Electronic packaging is one of the pillar subjects of ISTU. The present paper summarizes its curriculum of internet-based electronic packaging education. Following the overall description, the curriculum concerning thermal management of electronic equipment is explained in some detail. The ISTU program is still under development, and some challenges are foreseen. The most visible among them is the need to lower the cost of wide bandwidth communications. The future of internet schooling is discussed.

Original languageEnglish
Title of host publicationASME 2003 International Electronic Packaging Technical Conference and Exhibition
Place of PublicationNew York, NY
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages7-10
Number of pages4
Volume1
ISBN (Electronic)0791836746
ISBN (Print)0791836908
DOIs
Publication statusPublished - Jul 2003
Externally publishedYes
Event2003 International Electronic Packaging Technical Conference and Exhibition - Maui, United States
Duration: 6 Jul 200311 Jul 2003

Other

Other2003 International Electronic Packaging Technical Conference and Exhibition
CountryUnited States
CityMaui
Period6/07/0311/07/03

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