Enhanced polymer ablation rates using high-repetition-rate ultraviolet lasers

Elizabeth K. Illy; Daniel J. W. Brown; Michael J. Withford; James A. Piper

doi:10.1109/2944.814996

Enhanced polymer ablation rates using high-repetition-rate ultraviolet lasers

Elizabeth K. Illy, Daniel J. W. Brown, Michael J. Withford, James A. Piper

Research output: Contribution to journal › Article › peer-review

28 Citations (Scopus)

Abstract

Etch rates (μm/pulse) for glycol-modified polyethylene terephthalate (PETG) under pulsed UV (255 nm) laser processing are measured as a function of pulse repetition frequency in the range 0.7-15 kHz. Materials removal rates (μm/s) scale approximately linearly with pulse repetition frequency at a fluence of 0.59 J/cm², and there appears to be no attenuation of the ablating laser beam by the ejected material plume for pulse rates up to 15 kHz. The instantaneous etch rate for pulses in a sequence increases markedly (approx. 40%) for long pulse sequences (>100 pulses) at high PRF (15 kHz), an effect which can be used to increase machining rates while operating at a moderate laser fluence.

Original language	English
Pages (from-to)	1543-1548
Number of pages	6
Journal	IEEE Journal on Selected Topics in Quantum Electronics
Volume	5
Issue number	6
DOIs	https://doi.org/10.1109/2944.814996
Publication status	Published - Nov 1999

Keywords

laser ablation
laser machining
micromachining
pulsed lasers

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10.1109/2944.814996

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title = "Enhanced polymer ablation rates using high-repetition-rate ultraviolet lasers",

abstract = "Etch rates (μm/pulse) for glycol-modified polyethylene terephthalate (PETG) under pulsed UV (255 nm) laser processing are measured as a function of pulse repetition frequency in the range 0.7-15 kHz. Materials removal rates (μm/s) scale approximately linearly with pulse repetition frequency at a fluence of 0.59 J/cm2, and there appears to be no attenuation of the ablating laser beam by the ejected material plume for pulse rates up to 15 kHz. The instantaneous etch rate for pulses in a sequence increases markedly (approx. 40%) for long pulse sequences (>100 pulses) at high PRF (15 kHz), an effect which can be used to increase machining rates while operating at a moderate laser fluence.",

keywords = "laser ablation, laser machining, micromachining, pulsed lasers",

author = "Illy, {Elizabeth K.} and Brown, {Daniel J. W.} and Withford, {Michael J.} and Piper, {James A.}",

year = "1999",

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T1 - Enhanced polymer ablation rates using high-repetition-rate ultraviolet lasers

AU - Illy, Elizabeth K.

AU - Brown, Daniel J. W.

AU - Withford, Michael J.

AU - Piper, James A.

PY - 1999/11

Y1 - 1999/11

N2 - Etch rates (μm/pulse) for glycol-modified polyethylene terephthalate (PETG) under pulsed UV (255 nm) laser processing are measured as a function of pulse repetition frequency in the range 0.7-15 kHz. Materials removal rates (μm/s) scale approximately linearly with pulse repetition frequency at a fluence of 0.59 J/cm2, and there appears to be no attenuation of the ablating laser beam by the ejected material plume for pulse rates up to 15 kHz. The instantaneous etch rate for pulses in a sequence increases markedly (approx. 40%) for long pulse sequences (>100 pulses) at high PRF (15 kHz), an effect which can be used to increase machining rates while operating at a moderate laser fluence.

AB - Etch rates (μm/pulse) for glycol-modified polyethylene terephthalate (PETG) under pulsed UV (255 nm) laser processing are measured as a function of pulse repetition frequency in the range 0.7-15 kHz. Materials removal rates (μm/s) scale approximately linearly with pulse repetition frequency at a fluence of 0.59 J/cm2, and there appears to be no attenuation of the ablating laser beam by the ejected material plume for pulse rates up to 15 kHz. The instantaneous etch rate for pulses in a sequence increases markedly (approx. 40%) for long pulse sequences (>100 pulses) at high PRF (15 kHz), an effect which can be used to increase machining rates while operating at a moderate laser fluence.

KW - laser ablation

KW - laser machining

KW - micromachining

KW - pulsed lasers

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JO - IEEE Journal on Selected Topics in Quantum Electronics

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Enhanced polymer ablation rates using high-repetition-rate ultraviolet lasers

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