Enhanced thermal conductivity of polyimide composites with boron nitride nanosheets

Ting Wang; Mengjie Wang; Li Fu; Zehui Duan; Yapeng Chen; Xiao Hou; Yuming Wu; Shuangyi Li; Liangchao Guo; Ruiyang Kang; Nan Jiang; Jinhong Yu

doi:10.1038/s41598-018-19945-3

Enhanced thermal conductivity of polyimide composites with boron nitride nanosheets

Ting Wang, Mengjie Wang, Li Fu, Zehui Duan, Yapeng Chen, Xiao Hou, Yuming Wu, Shuangyi Li, Liangchao Guo, Ruiyang Kang, Nan Jiang^*, Jinhong Yu

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

154 Citations (Scopus)

85 Downloads (Pure)

Abstract

A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted liquid exfoliation from hexagonal boron nitride (h-BN) powder. BNNSs with an average thickness of 3 nm were obtained by a facile, low-cost, and scalable exfoliation method. Highly thermally conductive polyimide (PI) composite films with BNNSs filler were prepared by solution-casting process. The in-plane thermal conductivity of PI composite films with 7 wt% BNNSs is up to 2.95 W/mK, which increased by 1,080% compared to the neat PI. In contrast, the out-of plane thermal conductivity of the composites is 0.44 W/mK, with an increase by only 76%. The high anisotropy of thermal conductivity was verified to be due to the high alignment of the BNNSs. The PI/BNNSs composite films are attractive for the thermal management applications in the field of next-generation electronic devices.

Original language	English
Article number	1557
Pages (from-to)	1-8
Number of pages	8
Journal	Scientific Reports
Volume	8
DOIs	https://doi.org/10.1038/s41598-018-19945-3
Publication status	Published - 2018
Externally published	Yes

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Copyright the Author(s) 2018. Version archived for private and non-commercial use with the permission of the author/s and according to publisher conditions. For further rights please contact the publisher.

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title = "Enhanced thermal conductivity of polyimide composites with boron nitride nanosheets",

abstract = "A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted liquid exfoliation from hexagonal boron nitride (h-BN) powder. BNNSs with an average thickness of 3 nm were obtained by a facile, low-cost, and scalable exfoliation method. Highly thermally conductive polyimide (PI) composite films with BNNSs filler were prepared by solution-casting process. The in-plane thermal conductivity of PI composite films with 7 wt% BNNSs is up to 2.95 W/mK, which increased by 1,080% compared to the neat PI. In contrast, the out-of plane thermal conductivity of the composites is 0.44 W/mK, with an increase by only 76%. The high anisotropy of thermal conductivity was verified to be due to the high alignment of the BNNSs. The PI/BNNSs composite films are attractive for the thermal management applications in the field of next-generation electronic devices.",

author = "Ting Wang and Mengjie Wang and Li Fu and Zehui Duan and Yapeng Chen and Xiao Hou and Yuming Wu and Shuangyi Li and Liangchao Guo and Ruiyang Kang and Nan Jiang and Jinhong Yu",

note = "Copyright the Author(s) 2018. Version archived for private and non-commercial use with the permission of the author/s and according to publisher conditions. For further rights please contact the publisher.",

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doi = "10.1038/s41598-018-19945-3",

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AU - Wang, Ting

AU - Wang, Mengjie

AU - Fu, Li

AU - Duan, Zehui

AU - Chen, Yapeng

AU - Hou, Xiao

AU - Wu, Yuming

AU - Li, Shuangyi

AU - Guo, Liangchao

AU - Kang, Ruiyang

AU - Jiang, Nan

AU - Yu, Jinhong

N1 - Copyright the Author(s) 2018. Version archived for private and non-commercial use with the permission of the author/s and according to publisher conditions. For further rights please contact the publisher.

PY - 2018

Y1 - 2018

N2 - A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted liquid exfoliation from hexagonal boron nitride (h-BN) powder. BNNSs with an average thickness of 3 nm were obtained by a facile, low-cost, and scalable exfoliation method. Highly thermally conductive polyimide (PI) composite films with BNNSs filler were prepared by solution-casting process. The in-plane thermal conductivity of PI composite films with 7 wt% BNNSs is up to 2.95 W/mK, which increased by 1,080% compared to the neat PI. In contrast, the out-of plane thermal conductivity of the composites is 0.44 W/mK, with an increase by only 76%. The high anisotropy of thermal conductivity was verified to be due to the high alignment of the BNNSs. The PI/BNNSs composite films are attractive for the thermal management applications in the field of next-generation electronic devices.

AB - A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted liquid exfoliation from hexagonal boron nitride (h-BN) powder. BNNSs with an average thickness of 3 nm were obtained by a facile, low-cost, and scalable exfoliation method. Highly thermally conductive polyimide (PI) composite films with BNNSs filler were prepared by solution-casting process. The in-plane thermal conductivity of PI composite films with 7 wt% BNNSs is up to 2.95 W/mK, which increased by 1,080% compared to the neat PI. In contrast, the out-of plane thermal conductivity of the composites is 0.44 W/mK, with an increase by only 76%. The high anisotropy of thermal conductivity was verified to be due to the high alignment of the BNNSs. The PI/BNNSs composite films are attractive for the thermal management applications in the field of next-generation electronic devices.

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SP - 1

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JO - Scientific Reports

JF - Scientific Reports

M1 - 1557

ER -

Enhanced thermal conductivity of polyimide composites with boron nitride nanosheets

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