Femtosecond Bessel filaments for high aspect-ratio and taper-free micromachining of dielectrics

F. Courvoisier*, M. K. Bhuyan, M. Jacquot, P. A. Lacourt, L. Furfaro, M. J. Withford, J. M. Dudley

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contribution

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Abstract

Femtosecond Bessel beams are demonstrated for high aspect ratio machining in the filamentation regime with water assistance. Taper-free microchannels and micro-trenches are demonstrated with aspect ratio up to 40 and diameters down to 2 μm.

Original languageEnglish
Title of host publicationConference on Lasers and Electro-Optics 2010
Place of PublicationWashington, DC
PublisherOSA Publishing
Pages1-2
Number of pages2
ISBN (Print)9781557528896
DOIs
Publication statusPublished - May 2010
EventConference on Lasers and Electro-Optics (CLEO) - San Jose, United States
Duration: 16 May 201021 May 2010

Other

OtherConference on Lasers and Electro-Optics (CLEO)
CountryUnited States
CitySan Jose
Period16/05/1021/05/10

Bibliographical note

Copyright 2010 IEEE and Optical Society of America. Reprinted from Lasers and Electro-Optics (CLEO) and Quantum Electronics and Laser Science Conference (QELS), 2010 Conference on : date, 16-21 May 2010, with permission of the publishers. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Macquarie University’s products or services. Internal or personal use of this material is permitted. Permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

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