Femtosecond micromachining of high aspect ratio structures in fused silica using bessel beams

M. K. Bhuyan; F. Courvoisier; P. A. Lacourt; M. Jacquot; L. Furfaro; M. J. Withford; J. M. Dudley

doi:10.1109/CLEOE-EQEC.2009.5192163

Femtosecond micromachining of high aspect ratio structures in fused silica using bessel beams

M. K. Bhuyan, F. Courvoisier^*, P. A. Lacourt, M. Jacquot, L. Furfaro, M. J. Withford, J. M. Dudley

^*Corresponding author for this work

MQ Photonics Research Centre

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

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Abstract

Femtosecond laser micromachining is a laser processing technology with proven potential for the fabrication of a wide range of photonic devices. In the context of developing integrated components for microfluidics, a key issue is the machining of high aspect ratio micro and nano-channels, and the use of diffraction-free Bessel beams for this purpose has attracted much attention. However, although Bessel beams possess several attractive characteristics for this purpose, we show here that their practical use for high aspect ratio micromachining requires a careful selection of focussing and pump laser parameters. We report results of a systematic study of Bessel beam micromachining of structures of diameter < 5 mum in fused silica, and we describe conditions under which high quality and high aspect ratio structures can be reproducibly obtained. Within the parameter regimes identified here, Bessel beams present quantitative advantages when compared to diffractive Gaussian beams, especially for the drilling of channels of sub-10 mum diameter. Outside this parameter regime, there is little benefit in the Bessel beam approach.

Original language	English
Title of host publication	CLEO Europe-EQEC 2009
Subtitle of host publication	European Conference on Lasers and Electro-Optics 2009, and the European Quantum Electronics Conference:14-19 June, 2009, Munich, Germany
Place of Publication	Piscataway, NJ
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	1-1
Number of pages	1
ISBN (Print)	9781424440801
DOIs	https://doi.org/10.1109/CLEOE-EQEC.2009.5192163
Publication status	Published - 2009
Event	CLEO/Europe - EQEC 2009 - European Conference on Lasers and Electro-Optics and the European Quantum Electronics Conference - 2009 - Munich, Germany Duration: 14 Jun 2009 → 19 Jun 2009

Other

Other	CLEO/Europe - EQEC 2009 - European Conference on Lasers and Electro-Optics and the European Quantum Electronics Conference - 2009
Country/Territory	Germany
City	Munich
Period	14/06/09 → 19/06/09

Bibliographical note

Copyright 2009 IEEE. Reprinted from CLEO Europe-EQEC 2009 : European Conference on Lasers and Electro-Optics 2009, and the European Quantum Electronics Conference :14-19 June, 2009, Munich, Germany. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Macquarie Universityâ€™s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

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10.1109/CLEOE-EQEC.2009.5192163

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Bhuyan, M. K., Courvoisier, F., Lacourt, P. A., Jacquot, M., Furfaro, L., Withford, M. J., & Dudley, J. M. (2009). Femtosecond micromachining of high aspect ratio structures in fused silica using bessel beams. In CLEO Europe-EQEC 2009: European Conference on Lasers and Electro-Optics 2009, and the European Quantum Electronics Conference:14-19 June, 2009, Munich, Germany (pp. 1-1). [5192163] Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/CLEOE-EQEC.2009.5192163

Bhuyan, M. K. ; Courvoisier, F. ; Lacourt, P. A. et al. / Femtosecond micromachining of high aspect ratio structures in fused silica using bessel beams. CLEO Europe-EQEC 2009: European Conference on Lasers and Electro-Optics 2009, and the European Quantum Electronics Conference:14-19 June, 2009, Munich, Germany. Piscataway, NJ : Institute of Electrical and Electronics Engineers (IEEE), 2009. pp. 1-1

@inproceedings{74e5801406b24bd4a33518f926fd78f9,

title = "Femtosecond micromachining of high aspect ratio structures in fused silica using bessel beams",

abstract = "Femtosecond laser micromachining is a laser processing technology with proven potential for the fabrication of a wide range of photonic devices. In the context of developing integrated components for microfluidics, a key issue is the machining of high aspect ratio micro and nano-channels, and the use of diffraction-free Bessel beams for this purpose has attracted much attention. However, although Bessel beams possess several attractive characteristics for this purpose, we show here that their practical use for high aspect ratio micromachining requires a careful selection of focussing and pump laser parameters. We report results of a systematic study of Bessel beam micromachining of structures of diameter < 5 mum in fused silica, and we describe conditions under which high quality and high aspect ratio structures can be reproducibly obtained. Within the parameter regimes identified here, Bessel beams present quantitative advantages when compared to diffractive Gaussian beams, especially for the drilling of channels of sub-10 mum diameter. Outside this parameter regime, there is little benefit in the Bessel beam approach. ",

author = "Bhuyan, {M. K.} and F. Courvoisier and Lacourt, {P. A.} and M. Jacquot and L. Furfaro and Withford, {M. J.} and Dudley, {J. M.}",

note = "Copyright 2009 IEEE. Reprinted from CLEO Europe-EQEC 2009 : European Conference on Lasers and Electro-Optics 2009, and the European Quantum Electronics Conference :14-19 June, 2009, Munich, Germany. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Macquarie University{\^a}€{\texttrademark}s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.; CLEO/Europe - EQEC 2009 - European Conference on Lasers and Electro-Optics and the European Quantum Electronics Conference - 2009 ; Conference date: 14-06-2009 Through 19-06-2009",

year = "2009",

doi = "10.1109/CLEOE-EQEC.2009.5192163",

language = "English",

isbn = "9781424440801",

pages = "1--1",

booktitle = "CLEO Europe-EQEC 2009",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

}

Bhuyan, MK, Courvoisier, F, Lacourt, PA, Jacquot, M, Furfaro, L, Withford, MJ & Dudley, JM 2009, Femtosecond micromachining of high aspect ratio structures in fused silica using bessel beams. in CLEO Europe-EQEC 2009: European Conference on Lasers and Electro-Optics 2009, and the European Quantum Electronics Conference:14-19 June, 2009, Munich, Germany., 5192163, Institute of Electrical and Electronics Engineers (IEEE), Piscataway, NJ, pp. 1-1, CLEO/Europe - EQEC 2009 - European Conference on Lasers and Electro-Optics and the European Quantum Electronics Conference - 2009, Munich, Germany, 14/06/09. https://doi.org/10.1109/CLEOE-EQEC.2009.5192163

Femtosecond micromachining of high aspect ratio structures in fused silica using bessel beams. / Bhuyan, M. K.; Courvoisier, F.; Lacourt, P. A. et al.
CLEO Europe-EQEC 2009: European Conference on Lasers and Electro-Optics 2009, and the European Quantum Electronics Conference:14-19 June, 2009, Munich, Germany. Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE), 2009. p. 1-1 5192163.

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

TY - GEN

T1 - Femtosecond micromachining of high aspect ratio structures in fused silica using bessel beams

AU - Bhuyan, M. K.

AU - Courvoisier, F.

AU - Lacourt, P. A.

AU - Jacquot, M.

AU - Furfaro, L.

AU - Withford, M. J.

AU - Dudley, J. M.

N1 - Copyright 2009 IEEE. Reprinted from CLEO Europe-EQEC 2009 : European Conference on Lasers and Electro-Optics 2009, and the European Quantum Electronics Conference :14-19 June, 2009, Munich, Germany. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Macquarie Universityâ€™s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

PY - 2009

Y1 - 2009

N2 - Femtosecond laser micromachining is a laser processing technology with proven potential for the fabrication of a wide range of photonic devices. In the context of developing integrated components for microfluidics, a key issue is the machining of high aspect ratio micro and nano-channels, and the use of diffraction-free Bessel beams for this purpose has attracted much attention. However, although Bessel beams possess several attractive characteristics for this purpose, we show here that their practical use for high aspect ratio micromachining requires a careful selection of focussing and pump laser parameters. We report results of a systematic study of Bessel beam micromachining of structures of diameter < 5 mum in fused silica, and we describe conditions under which high quality and high aspect ratio structures can be reproducibly obtained. Within the parameter regimes identified here, Bessel beams present quantitative advantages when compared to diffractive Gaussian beams, especially for the drilling of channels of sub-10 mum diameter. Outside this parameter regime, there is little benefit in the Bessel beam approach.

AB - Femtosecond laser micromachining is a laser processing technology with proven potential for the fabrication of a wide range of photonic devices. In the context of developing integrated components for microfluidics, a key issue is the machining of high aspect ratio micro and nano-channels, and the use of diffraction-free Bessel beams for this purpose has attracted much attention. However, although Bessel beams possess several attractive characteristics for this purpose, we show here that their practical use for high aspect ratio micromachining requires a careful selection of focussing and pump laser parameters. We report results of a systematic study of Bessel beam micromachining of structures of diameter < 5 mum in fused silica, and we describe conditions under which high quality and high aspect ratio structures can be reproducibly obtained. Within the parameter regimes identified here, Bessel beams present quantitative advantages when compared to diffractive Gaussian beams, especially for the drilling of channels of sub-10 mum diameter. Outside this parameter regime, there is little benefit in the Bessel beam approach.

UR - http://www.scopus.com/inward/record.url?scp=70449578599&partnerID=8YFLogxK

U2 - 10.1109/CLEOE-EQEC.2009.5192163

DO - 10.1109/CLEOE-EQEC.2009.5192163

M3 - Conference proceeding contribution

AN - SCOPUS:84897963637

SN - 9781424440801

SP - 1

EP - 1

BT - CLEO Europe-EQEC 2009

PB - Institute of Electrical and Electronics Engineers (IEEE)

CY - Piscataway, NJ

T2 - CLEO/Europe - EQEC 2009 - European Conference on Lasers and Electro-Optics and the European Quantum Electronics Conference - 2009

Y2 - 14 June 2009 through 19 June 2009

ER -

Bhuyan MK, Courvoisier F, Lacourt PA, Jacquot M, Furfaro L, Withford MJ et al. Femtosecond micromachining of high aspect ratio structures in fused silica using bessel beams. In CLEO Europe-EQEC 2009: European Conference on Lasers and Electro-Optics 2009, and the European Quantum Electronics Conference:14-19 June, 2009, Munich, Germany. Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE). 2009. p. 1-1. 5192163 doi: 10.1109/CLEOE-EQEC.2009.5192163

Femtosecond micromachining of high aspect ratio structures in fused silica using bessel beams

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