TY - GEN
T1 - Heat transfer enhancement in microchannel using nanofluids
AU - Fadzin, Khairul Afif
AU - Lee, Ann
PY - 2014
Y1 - 2014
N2 - Numerical investigation of heat transfer enhancement in two-dimensional microchannel heat sink (MCHS) using Al2O3-water, CuO-water and TiO2-water was conducted. The effect of different type of nanoparticles at particle volume concentration of 1%, 2% and 5% on the thermal performance in the MCHS was examined. The thermal performance is increased when nanofluids with high thermal conductivity and low dynamic viscosity was used. As the particle volume concentration increases, the heat transfer performance also improved. The result shows that the heat transfer performance of all the nanofluids used in this study was better than that of pure water. Overall, nanofluids with Al2O3-water at 5% particle volume concentration show the best cooling performance.
AB - Numerical investigation of heat transfer enhancement in two-dimensional microchannel heat sink (MCHS) using Al2O3-water, CuO-water and TiO2-water was conducted. The effect of different type of nanoparticles at particle volume concentration of 1%, 2% and 5% on the thermal performance in the MCHS was examined. The thermal performance is increased when nanofluids with high thermal conductivity and low dynamic viscosity was used. As the particle volume concentration increases, the heat transfer performance also improved. The result shows that the heat transfer performance of all the nanofluids used in this study was better than that of pure water. Overall, nanofluids with Al2O3-water at 5% particle volume concentration show the best cooling performance.
KW - Conjugate heat transfer
KW - Microchannel
KW - Nanofluids
UR - http://www.scopus.com/inward/record.url?scp=84891956590&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMM.465-466.536
DO - 10.4028/www.scientific.net/AMM.465-466.536
M3 - Conference proceeding contribution
AN - SCOPUS:84891956590
SN - 9783037859339
VL - 465-466
T3 - Applied Mechanics and Materials
SP - 536
EP - 540
BT - 4th Mechanical and Manufacturing Engineering
PB - Elsevier
CY - Zurich, Switzerland
T2 - 4th International Conference on Mechanical and Manufacturing Engineering, ICME 2013
Y2 - 17 December 2013 through 18 December 2013
ER -