High-quality CO2 laser machining of LTCC structures for themal management of a group of single-emitter laser diodes

Alberto Campos Zatarain*, Aaron McKay, Howard J. Baker, Denis R. Hall, Marc Desmulliez

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contributionpeer-review

1 Citation (Scopus)

Abstract

There has been recent interest in the use of LTCC (low temperature co-fired ceramics) technology as a platform for optical integration of both active and passive components because of its electrical, thermal and mechanical characteristics. Active components require methods for removing the heat generated without compromising the passive alignment of surrounding components. A thermal management structure for impingement water-cooling of a group of single-emitter laser diodes is reported, fabricated with CO2 laser cut layers of LTCC to within tens of micron accuracy. We present a technique that uses precisely fitted, laser-cut nanocarbon layers to remove the problem of the collapse of internal water channels during isostatic pressure lamination. The structure provides 5 water jets to localize cooling under the diode laser chip, reducing thermal impedance.

Original languageEnglish
Title of host publicationProceedings - 2009 International Symposium on Microelectronics, IMAPS 2009
Place of PublicationResearch Triangle Park, NC
PublisherInternational Microelectronics Assembly and Packaging Society ( IMAPS )
Pages452-458
Number of pages7
ISBN (Print)0930815890, 9780930815899
Publication statusPublished - 2009
Externally publishedYes
Event42nd International Symposium on Microelectronics, IMAPS 2009 - San Jose, CA, United States
Duration: 1 Nov 20095 Nov 2009

Other

Other42nd International Symposium on Microelectronics, IMAPS 2009
Country/TerritoryUnited States
CitySan Jose, CA
Period1/11/095/11/09

Keywords

  • Laser diodes
  • LTCC
  • Thermal management

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