Abstract
There has been recent interest in the use of LTCC (low temperature co-fired ceramics) technology as a platform for optical integration of both active and passive components because of its electrical, thermal and mechanical characteristics. Active components require methods for removing the heat generated without compromising the passive alignment of surrounding components. A thermal management structure for impingement water-cooling of a group of single-emitter laser diodes is reported, fabricated with CO2 laser cut layers of LTCC to within tens of micron accuracy. We present a technique that uses precisely fitted, laser-cut nanocarbon layers to remove the problem of the collapse of internal water channels during isostatic pressure lamination. The structure provides 5 water jets to localize cooling under the diode laser chip, reducing thermal impedance.
Original language | English |
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Title of host publication | Proceedings - 2009 International Symposium on Microelectronics, IMAPS 2009 |
Place of Publication | Research Triangle Park, NC |
Publisher | International Microelectronics Assembly and Packaging Society ( IMAPS ) |
Pages | 452-458 |
Number of pages | 7 |
ISBN (Print) | 0930815890, 9780930815899 |
Publication status | Published - 2009 |
Externally published | Yes |
Event | 42nd International Symposium on Microelectronics, IMAPS 2009 - San Jose, CA, United States Duration: 1 Nov 2009 → 5 Nov 2009 |
Other
Other | 42nd International Symposium on Microelectronics, IMAPS 2009 |
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Country/Territory | United States |
City | San Jose, CA |
Period | 1/11/09 → 5/11/09 |
Keywords
- Laser diodes
- LTCC
- Thermal management