High speed micro-machining with UV-copper vapor lasers

Elizabeth K. Illy, A. C J Glover, Michael J. Withford, James A. Piper

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Ablation rate characteristics (etch rates) are presented for micro-machining of polyimide (kapton) and PETG using a frequency doubled Copper Vapor Laser (uv-CVL) at 255 nm and a frequency quadrupled Nd:YLF (4*Nd:YLF) laser at 261 nm. A comparison is made of the etch rates obtained by continuous ablation at 4.25 kHz with the uv-CVL with rates obtained for bursts of pulses with 2 second intervals between bursts. These results suggest that the observed decrease in ablation depth per pulse after a number of pulses for fluences above 0.6 J/cm2 is due to attenuation of succeeding laser pulses by the plume of previously-ejected material. Preliminary results of the effect of sample temperature on ablation rates are also presented.

Original languageEnglish
Pages (from-to)432-441
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume2703
DOIs
Publication statusPublished - 1996

Keywords

  • Copper vapour laser
  • Micro-machining
  • Nd:YLF laser
  • Polymer ablation

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