High speed micro-machining with UV-copper vapor lasers

Elizabeth K. Illy; A. C J Glover; Michael J. Withford; James A. Piper

doi:10.1117/12.237754

High speed micro-machining with UV-copper vapor lasers

Elizabeth K. Illy, A. C J Glover, Michael J. Withford, James A. Piper

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

Ablation rate characteristics (etch rates) are presented for micro-machining of polyimide (kapton) and PETG using a frequency doubled Copper Vapor Laser (uv-CVL) at 255 nm and a frequency quadrupled Nd:YLF (4*Nd:YLF) laser at 261 nm. A comparison is made of the etch rates obtained by continuous ablation at 4.25 kHz with the uv-CVL with rates obtained for bursts of pulses with 2 second intervals between bursts. These results suggest that the observed decrease in ablation depth per pulse after a number of pulses for fluences above 0.6 J/cm² is due to attenuation of succeeding laser pulses by the plume of previously-ejected material. Preliminary results of the effect of sample temperature on ablation rates are also presented.

Original language	English
Pages (from-to)	432-441
Number of pages	10
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	2703
DOIs	https://doi.org/10.1117/12.237754
Publication status	Published - 1996

Keywords

Copper vapour laser
Micro-machining
Nd:YLF laser
Polymer ablation

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title = "High speed micro-machining with UV-copper vapor lasers",

abstract = "Ablation rate characteristics (etch rates) are presented for micro-machining of polyimide (kapton) and PETG using a frequency doubled Copper Vapor Laser (uv-CVL) at 255 nm and a frequency quadrupled Nd:YLF (4*Nd:YLF) laser at 261 nm. A comparison is made of the etch rates obtained by continuous ablation at 4.25 kHz with the uv-CVL with rates obtained for bursts of pulses with 2 second intervals between bursts. These results suggest that the observed decrease in ablation depth per pulse after a number of pulses for fluences above 0.6 J/cm2 is due to attenuation of succeeding laser pulses by the plume of previously-ejected material. Preliminary results of the effect of sample temperature on ablation rates are also presented.",

keywords = "Copper vapour laser, Micro-machining, Nd:YLF laser, Polymer ablation",

author = "Illy, \{Elizabeth K.\} and Glover, \{A. C J\} and Withford, \{Michael J.\} and Piper, \{James A.\}",

year = "1996",

doi = "10.1117/12.237754",

language = "English",

volume = "2703",

pages = "432--441",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

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TY - JOUR

T1 - High speed micro-machining with UV-copper vapor lasers

AU - Illy, Elizabeth K.

AU - Glover, A. C J

AU - Withford, Michael J.

AU - Piper, James A.

PY - 1996

Y1 - 1996

N2 - Ablation rate characteristics (etch rates) are presented for micro-machining of polyimide (kapton) and PETG using a frequency doubled Copper Vapor Laser (uv-CVL) at 255 nm and a frequency quadrupled Nd:YLF (4*Nd:YLF) laser at 261 nm. A comparison is made of the etch rates obtained by continuous ablation at 4.25 kHz with the uv-CVL with rates obtained for bursts of pulses with 2 second intervals between bursts. These results suggest that the observed decrease in ablation depth per pulse after a number of pulses for fluences above 0.6 J/cm2 is due to attenuation of succeeding laser pulses by the plume of previously-ejected material. Preliminary results of the effect of sample temperature on ablation rates are also presented.

AB - Ablation rate characteristics (etch rates) are presented for micro-machining of polyimide (kapton) and PETG using a frequency doubled Copper Vapor Laser (uv-CVL) at 255 nm and a frequency quadrupled Nd:YLF (4*Nd:YLF) laser at 261 nm. A comparison is made of the etch rates obtained by continuous ablation at 4.25 kHz with the uv-CVL with rates obtained for bursts of pulses with 2 second intervals between bursts. These results suggest that the observed decrease in ablation depth per pulse after a number of pulses for fluences above 0.6 J/cm2 is due to attenuation of succeeding laser pulses by the plume of previously-ejected material. Preliminary results of the effect of sample temperature on ablation rates are also presented.

KW - Copper vapour laser

KW - Micro-machining

KW - Nd:YLF laser

KW - Polymer ablation

UR - https://www.scopus.com/pages/publications/0342640295

U2 - 10.1117/12.237754

DO - 10.1117/12.237754

M3 - Article

AN - SCOPUS:0342640295

SN - 0277-786X

VL - 2703

SP - 432

EP - 441

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

ER -

High speed micro-machining with UV-copper vapor lasers

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