TY - BOOK
T1 - Industry standard FDSOI compact model BSIM-IMG for IC design
A2 - Hu, Chenming
A2 - Khandelwal, Sourabh
A2 - Chauhan, Yogesh Singh
A2 - McKay, Thomas
A2 - Watts, Josef
A2 - Duarte, Juan Pablo
A2 - Kushwaha, Pragya
A2 - Agarwal, Harshit
PY - 2019
Y1 - 2019
UR - http://www.scopus.com/inward/record.url?scp=85080807203&partnerID=8YFLogxK
U2 - 10.1016/C2017-0-00467-6
DO - 10.1016/C2017-0-00467-6
M3 - Edited Book/Anthology
AN - SCOPUS:85080807203
SN - 9780081024010
T3 - Woodhead Publishing Series in Electronic and Optical Materials
BT - Industry standard FDSOI compact model BSIM-IMG for IC design
PB - Elsevier
CY - Duxford ; Cambridge, US ; Kidlington
ER -