Industry standard FDSOI compact model BSIM-IMG for IC design

Chenming Hu; Sourabh Khandelwal; Yogesh Singh Chauhan; Thomas McKay; Josef Watts; Juan Pablo Duarte; Pragya Kushwaha; Harshit Agarwal

doi:10.1016/C2017-0-00467-6

Industry standard FDSOI compact model BSIM-IMG for IC design

Chenming Hu (Editor), Sourabh Khandelwal (Editor), Yogesh Singh Chauhan (Editor), Thomas McKay (Editor), Josef Watts (Editor), Juan Pablo Duarte (Editor), Pragya Kushwaha (Editor), Harshit Agarwal (Editor)

School of Engineering

Research output: Book/Report › Edited Book/Anthology › peer-review

12 Citations (Scopus)

Abstract

Original language	English
Place of Publication	Duxford ; Cambridge, US ; Kidlington
Publisher	Elsevier
Number of pages	248
ISBN (Electronic)	9780081024027
ISBN (Print)	9780081024010
DOIs	https://doi.org/10.1016/C2017-0-00467-6
Publication status	Published - 2019

Publication series

Name	Woodhead Publishing Series in Electronic and Optical Materials
Publisher	Elsevier

Access to Document

10.1016/C2017-0-00467-6

Cite this

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title = "Industry standard FDSOI compact model BSIM-IMG for IC design",

editor = "Chenming Hu and Sourabh Khandelwal and Chauhan, {Yogesh Singh} and Thomas McKay and Josef Watts and Duarte, {Juan Pablo} and Pragya Kushwaha and Harshit Agarwal",

year = "2019",

doi = "10.1016/C2017-0-00467-6",

language = "English",

isbn = "9780081024010",

series = "Woodhead Publishing Series in Electronic and Optical Materials",

publisher = "Elsevier",

address = "United States",

}

TY - BOOK

T1 - Industry standard FDSOI compact model BSIM-IMG for IC design

A2 - Hu, Chenming

A2 - Khandelwal, Sourabh

A2 - Chauhan, Yogesh Singh

A2 - McKay, Thomas

A2 - Watts, Josef

A2 - Duarte, Juan Pablo

A2 - Kushwaha, Pragya

A2 - Agarwal, Harshit

PY - 2019

Y1 - 2019

UR - http://www.scopus.com/inward/record.url?scp=85080807203&partnerID=8YFLogxK

U2 - 10.1016/C2017-0-00467-6

DO - 10.1016/C2017-0-00467-6

M3 - Edited Book/Anthology

AN - SCOPUS:85080807203

SN - 9780081024010

T3 - Woodhead Publishing Series in Electronic and Optical Materials

BT - Industry standard FDSOI compact model BSIM-IMG for IC design

PB - Elsevier

CY - Duxford ; Cambridge, US ; Kidlington

ER -

Industry standard FDSOI compact model BSIM-IMG for IC design

Abstract

Publication series

Access to Document

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Cite this