Linear array of woodpile EBG sectoral horn antennas

Andrew R. Weily*, Karu P. Esselle, Trevor S. Bird, Barry C. Sanders

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

33 Citations (Scopus)
20 Downloads (Pure)

Abstract

A technique is described for creating linear array antennas that conform to the natural stacking sequence of the woodpile electromagnetic bandgap (EBG) material. Each element in the linear array consists of a woodpile EBG sectoral horn antenna. The electromagnetic confinement mechanism within each horn antenna relies wholly on the 3-D EBG of the woodpile material. The array element has a typical sectoral horn pattern with a directional beam in one principal plane and a broader beam in the other. The bandwidth of the sectoral horn is almost equal to that of the defect EBG waveguide. Measured and theoretical results for radiation patterns, impedance bandwidth and gain of a sectoral horn antenna made from alumina are described, and theoretical results for a design made from silicon are presented. It is shown that the layer-by-layer nature of the woodpile EBG material enables sectoral horn antennas to be easily stacked together in the E-plane to create linear arrays. Analysis of the mutual coupling as a function of element separation and its effect on reflection coefficient are presented for a two-element linear array in silicon. Theoretical analyses for fixed and scanned beam linear arrays of silicon woodpile EBG sectoral horns are described and finite-difference time-domain results are compared with array theory. The fixed beam arrays are designed for high directivity while the scanned beam array enables wide angle beam steering through the use of parasitic array elements.

Original languageEnglish
Pages (from-to)2263-2274
Number of pages12
JournalIEEE Transactions on Antennas and Propagation
Volume54
Issue number8
DOIs
Publication statusPublished - Aug 2006

Bibliographical note

Copyright 2006 Reprinted from IEEE transactions on antennas and propagation. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Macquarie University’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org.By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

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