Low bend loss waveguides enable compact, efficient 3D photonic chips

Alexander Arriola*, Simon Gross, Nemanja Jovanovic, Ned Charles, Peter G. Tuthill, Santiago M. Olaizola, Alexander Fuerbach, Michael J. Withford

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

127 Citations (Scopus)
55 Downloads (Pure)


We present a novel method to fabricate low bend loss femtosecond-laser written waveguides that exploits the differential thermal stabilities of laser induced refractive index modifications. The technique consists of a two-step process; the first involves fabricating large multimode waveguides, while the second step consists of a thermal postannealing process, which erases the outer ring of the refractive index profile, enabling single mode operation in the C-band. By using this procedure we report waveguides with sharp bends (down to 16.6 mm radius) and high (80%) normalized throughputs. This procedure was used to fabricate an efficient 3D, photonic device known as a "pupil- remapper" with negligible bend losses for the first time. The process will also allow for complex chips, based on 10's - 100's of waveguides to be realized in a compact foot print with short fabrication times.

Original languageEnglish
Pages (from-to)2978-2986
Number of pages9
JournalOptics Express
Issue number3
Publication statusPublished - 11 Feb 2013

Bibliographical note

This paper was published in Optics Express and is made available as an electronic reprint with the permission of OSA. The paper can be found at the following URL on the OSA website: [http://http://www.opticsinfobase.org/oe/abstract.cfm?uri=oe-21-3-2978]. Systematic or multiple reproduction or distribution to multiple locations via electronic or other means is prohibited and is subject to penalties under law.


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