Manifold microchannel heat sinks: Conjugate and extended models

David Copeland*, Masud Behnia, Wataru Nakayama

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)

Abstract

Numerical analysis of manifold microchannel (MMC) heat sinks are performed. The MMC differs from a traditional microchannel heat sink where the flow length is greatly reduced to a small fraction of the total length of the heat sink. Alternating inlet and outlet channels guide the coolant to and from the microchannels. A silicon heat sink cooled by fluorocarbon liquid is studied.

Original languageEnglish
Pages (from-to)139-152
Number of pages14
JournalInternational Journal of Microelectronic Packaging Materials and Technologies
Volume1
Issue number2
Publication statusPublished - 1998
Externally publishedYes

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