Numerical analysis of manifold microchannel (MMC) heat sinks are performed. The MMC differs from a traditional microchannel heat sink where the flow length is greatly reduced to a small fraction of the total length of the heat sink. Alternating inlet and outlet channels guide the coolant to and from the microchannels. A silicon heat sink cooled by fluorocarbon liquid is studied.
|Number of pages||14|
|Journal||International Journal of Microelectronic Packaging Materials and Technologies|
|Publication status||Published - 1998|