Abstract
Numerical analysis of manifold microchannel (MMC) heat sinks are performed. The MMC differs from a traditional microchannel heat sink where the flow length is greatly reduced to a small fraction of the total length of the heat sink. Alternating inlet and outlet channels guide the coolant to and from the microchannels. A silicon heat sink cooled by fluorocarbon liquid is studied.
| Original language | English |
|---|---|
| Pages (from-to) | 139-152 |
| Number of pages | 14 |
| Journal | International Journal of Microelectronic Packaging Materials and Technologies |
| Volume | 1 |
| Issue number | 2 |
| Publication status | Published - 1998 |
| Externally published | Yes |