Abstract
Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5 GHz require low power and high quality integrated transceiver solutions. The integration of RF front end especially poses a great challenge to these applications as traditional system on chip (SOC) approach is quite inefficient. A system on package approach (SOP) can address the problems in an optimum way. A challenging task is to design integrated passives. These passives are then fabricated using MCM-D technology. Inductors and capacitors are compared on the bases of their Q-factors and SRF (self resonance frequency). RF receiver module is implemented using benzocyclobutene (BCB) as interlayer material and liquid crystal polymer (LCP) as substrate.
Original language | English |
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Pages (from-to) | 748-752 |
Number of pages | 5 |
Journal | WSEAS Transactions on Circuits and Systems |
Volume | 5 |
Issue number | 5 |
Publication status | Published - May 2006 |
Externally published | Yes |
Keywords
- Bezocyclobutene (BCB)
- Integrated passives
- Integrated RF front ends
- Liquid crystal polymer (LCP)
- Multichip module (MCM)
- System-on-chip (SOC)
- System-on-package (SOP)
- Wireless local area network (WLAN)