Microsystems packaging roadmap for next generation wireless receivers

Yasar Amin*, Ahsan Ali, Muhammad Zafrullah

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review


Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5 GHz require low power and high quality integrated transceiver solutions. The integration of RF front end especially poses a great challenge to these applications as traditional system on chip (SOC) approach is quite inefficient. A system on package approach (SOP) can address the problems in an optimum way. A challenging task is to design integrated passives. These passives are then fabricated using MCM-D technology. Inductors and capacitors are compared on the bases of their Q-factors and SRF (self resonance frequency). RF receiver module is implemented using benzocyclobutene (BCB) as interlayer material and liquid crystal polymer (LCP) as substrate.

Original languageEnglish
Pages (from-to)748-752
Number of pages5
JournalWSEAS Transactions on Circuits and Systems
Issue number5
Publication statusPublished - May 2006
Externally publishedYes


  • Bezocyclobutene (BCB)
  • Integrated passives
  • Integrated RF front ends
  • Liquid crystal polymer (LCP)
  • Multichip module (MCM)
  • System-on-chip (SOC)
  • System-on-package (SOP)
  • Wireless local area network (WLAN)


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