MMIC process for integrated power converters

Aaron Pereira; Syed Albahrani; Anthony Parker; Graham Town; Michael Heimlich

doi:10.1109/TENCONSpring.2013.6584455

MMIC process for integrated power converters

Aaron Pereira, Syed Albahrani, Anthony Parker, Graham Town, Michael Heimlich

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

1 Citation (Scopus)

Abstract

Commercial RF MMIC fabrication process technologies were investigated for fabrication of integrated switching power converters. Pulsed IV characterization of GaN FETs revealed ON resistance dependence on off state bias, and current collapse at high temperatures. The degradation in ON resistance and current collapse can severely impact the efficiency of switching circuits fabricated in these processes.

Original language	English
Title of host publication	IEEE 2013 Tencon - Spring, TENCONSpring 2013 - Conference Proceedings
Place of Publication	Piscataway, NJ
Publisher	Institute of Electrical and Electronics Engineers (IEEE)
Pages	277-279
Number of pages	3
ISBN (Print)	9781467363495
DOIs	https://doi.org/10.1109/TENCONSpring.2013.6584455
Publication status	Published - 2013
Event	2013 1st IEEE TENCON Spring Conference, TENCONSpring 2013 - Sydney, NSW, Australia Duration: 17 Apr 2013 → 19 Apr 2013

Other

Other	2013 1st IEEE TENCON Spring Conference, TENCONSpring 2013
Country/Territory	Australia
City	Sydney, NSW
Period	17/04/13 → 19/04/13

Access to Document

10.1109/TENCONSpring.2013.6584455

Cite this

@inproceedings{f159771df7c84eaa9fffaeadd75fa143,

title = "MMIC process for integrated power converters",

abstract = "Commercial RF MMIC fabrication process technologies were investigated for fabrication of integrated switching power converters. Pulsed IV characterization of GaN FETs revealed ON resistance dependence on off state bias, and current collapse at high temperatures. The degradation in ON resistance and current collapse can severely impact the efficiency of switching circuits fabricated in these processes.",

author = "Aaron Pereira and Syed Albahrani and Anthony Parker and Graham Town and Michael Heimlich",

year = "2013",

doi = "10.1109/TENCONSpring.2013.6584455",

language = "English",

isbn = "9781467363495",

pages = "277--279",

booktitle = "IEEE 2013 Tencon - Spring, TENCONSpring 2013 - Conference Proceedings",

publisher = "Institute of Electrical and Electronics Engineers (IEEE)",

address = "United States",

note = "2013 1st IEEE TENCON Spring Conference, TENCONSpring 2013 ; Conference date: 17-04-2013 Through 19-04-2013",

}

Pereira, A, Albahrani, S, Parker, A , Town, G & Heimlich, M 2013, MMIC process for integrated power converters. in IEEE 2013 Tencon - Spring, TENCONSpring 2013 - Conference Proceedings., 6584455, Institute of Electrical and Electronics Engineers (IEEE), Piscataway, NJ, pp. 277-279, 2013 1st IEEE TENCON Spring Conference, TENCONSpring 2013, Sydney, NSW, Australia, 17/04/13. https://doi.org/10.1109/TENCONSpring.2013.6584455

MMIC process for integrated power converters. / Pereira, Aaron; Albahrani, Syed; Parker, Anthony et al.
IEEE 2013 Tencon - Spring, TENCONSpring 2013 - Conference Proceedings. Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE), 2013. p. 277-279 6584455.

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding contribution › peer-review

TY - GEN

T1 - MMIC process for integrated power converters

AU - Pereira, Aaron

AU - Albahrani, Syed

AU - Parker, Anthony

AU - Town, Graham

AU - Heimlich, Michael

PY - 2013

Y1 - 2013

N2 - Commercial RF MMIC fabrication process technologies were investigated for fabrication of integrated switching power converters. Pulsed IV characterization of GaN FETs revealed ON resistance dependence on off state bias, and current collapse at high temperatures. The degradation in ON resistance and current collapse can severely impact the efficiency of switching circuits fabricated in these processes.

AB - Commercial RF MMIC fabrication process technologies were investigated for fabrication of integrated switching power converters. Pulsed IV characterization of GaN FETs revealed ON resistance dependence on off state bias, and current collapse at high temperatures. The degradation in ON resistance and current collapse can severely impact the efficiency of switching circuits fabricated in these processes.

UR - http://www.scopus.com/inward/record.url?scp=84883683415&partnerID=8YFLogxK

U2 - 10.1109/TENCONSpring.2013.6584455

DO - 10.1109/TENCONSpring.2013.6584455

M3 - Conference proceeding contribution

AN - SCOPUS:84883683415

SN - 9781467363495

SP - 277

EP - 279

BT - IEEE 2013 Tencon - Spring, TENCONSpring 2013 - Conference Proceedings

PB - Institute of Electrical and Electronics Engineers (IEEE)

CY - Piscataway, NJ

T2 - 2013 1st IEEE TENCON Spring Conference, TENCONSpring 2013

Y2 - 17 April 2013 through 19 April 2013

ER -

MMIC process for integrated power converters

Abstract

Other

Access to Document

Other files and links

Fingerprint

Cite this