Morphological stability of Pt coatings deposited on Cr substrates

Nasheeta Hanief; Candace I. Lang; Miroslava Topić

doi:10.1016/j.tsf.2016.02.042

Morphological stability of Pt coatings deposited on Cr substrates

Nasheeta Hanief^*, Candace I. Lang, Miroslava Topić

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Abstract

The morphological stability of coatings is an important factor for the reliability of microelectronic devices operating at elevated temperature. The focus of this work was to characterise and explain the coating degradation mechanisms of Pt-Cr coatings and thereby to find ways of extending their operating temperature range. Platinum coatings on chromium are shown to be morphologically stable up to 800 °C; at higher temperatures degradation is observed. Scanning electron microscopy of coated specimens with a systematic variation in both coating thickness and annealing temperature shows that significant grain-boundary grooving and agglomeration can occur. This has important implications for the reliability of microelectronic devices operating at elevated temperatures.

Original language	English
Pages (from-to)	7-11
Number of pages	5
Journal	Thin Solid Films
Volume	604
DOIs	https://doi.org/10.1016/j.tsf.2016.02.042
Publication status	Published - 1 Apr 2016

Keywords

Agglomeration
Grooving
Phase formation
Thermal annealing
Thin coatings

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10.1016/j.tsf.2016.02.042

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title = "Morphological stability of Pt coatings deposited on Cr substrates",

abstract = "The morphological stability of coatings is an important factor for the reliability of microelectronic devices operating at elevated temperature. The focus of this work was to characterise and explain the coating degradation mechanisms of Pt-Cr coatings and thereby to find ways of extending their operating temperature range. Platinum coatings on chromium are shown to be morphologically stable up to 800 °C; at higher temperatures degradation is observed. Scanning electron microscopy of coated specimens with a systematic variation in both coating thickness and annealing temperature shows that significant grain-boundary grooving and agglomeration can occur. This has important implications for the reliability of microelectronic devices operating at elevated temperatures.",

keywords = "Agglomeration, Grooving, Phase formation, Thermal annealing, Thin coatings",

author = "Nasheeta Hanief and Lang, {Candace I.} and Miroslava Topi{\'c}",

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doi = "10.1016/j.tsf.2016.02.042",

language = "English",

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AU - Hanief, Nasheeta

AU - Lang, Candace I.

AU - Topić, Miroslava

PY - 2016/4/1

Y1 - 2016/4/1

N2 - The morphological stability of coatings is an important factor for the reliability of microelectronic devices operating at elevated temperature. The focus of this work was to characterise and explain the coating degradation mechanisms of Pt-Cr coatings and thereby to find ways of extending their operating temperature range. Platinum coatings on chromium are shown to be morphologically stable up to 800 °C; at higher temperatures degradation is observed. Scanning electron microscopy of coated specimens with a systematic variation in both coating thickness and annealing temperature shows that significant grain-boundary grooving and agglomeration can occur. This has important implications for the reliability of microelectronic devices operating at elevated temperatures.

AB - The morphological stability of coatings is an important factor for the reliability of microelectronic devices operating at elevated temperature. The focus of this work was to characterise and explain the coating degradation mechanisms of Pt-Cr coatings and thereby to find ways of extending their operating temperature range. Platinum coatings on chromium are shown to be morphologically stable up to 800 °C; at higher temperatures degradation is observed. Scanning electron microscopy of coated specimens with a systematic variation in both coating thickness and annealing temperature shows that significant grain-boundary grooving and agglomeration can occur. This has important implications for the reliability of microelectronic devices operating at elevated temperatures.

KW - Agglomeration

KW - Grooving

KW - Phase formation

KW - Thermal annealing

KW - Thin coatings

UR - http://www.scopus.com/inward/record.url?scp=84961182135&partnerID=8YFLogxK

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DO - 10.1016/j.tsf.2016.02.042

M3 - Article

AN - SCOPUS:84961182135

VL - 604

SP - 7

EP - 11

JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

ER -

Morphological stability of Pt coatings deposited on Cr substrates

Abstract

Keywords

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