Multi-dielectric layer multi-patches microstrip antenna for UWB applications

Nasimuddin*, Zhi Ning Chen, Terence S P See, Xianming Qing

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contribution

1 Citation (Scopus)

Abstract

A wideband compact multilayer microstrip antenna with a new feeding arrangement is presented for ultra-wideband (UWB) applications. The antenna consists of a driven patch radiator and 5 stacked parasitic radiators. A new feeding technique is proposed to enhance the impedance bandwidth of the antenna structure. The feeding structure consists a via connected to a microstrip line which excites the patch radiator in a broadband manner. In order to achieve UWB performance, parasitic patches are electromagnetically coupled to the driven patch in the multilayered microstrip structures. The proposed antenna has a measured 10-dB return loss bandwidth of 48% and directional radiation, which covers the lower UWB band very well. The maximum gain is more than 6.5 dBi across the bandwidth. Furthermore, the proposed broadband structure can be deployed in a space-limited environment and multi-dielectric layer antenna applications.

Original languageEnglish
Title of host publicationProceedings of the 10th European Conference on Wireless Technology
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages261-263
Number of pages3
ISBN (Print)287487003X, 9782874870033
DOIs
Publication statusPublished - 2007
Externally publishedYes
EventEuropean Microwave Week 2007, EuMW 2007 - 10th European Conference on Wireless Technology, ECWT 2007 - Munich, Germany
Duration: 8 Oct 200710 Oct 2007

Other

OtherEuropean Microwave Week 2007, EuMW 2007 - 10th European Conference on Wireless Technology, ECWT 2007
CountryGermany
CityMunich
Period8/10/0710/10/07

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  • Cite this

    Nasimuddin, Chen, Z. N., See, T. S. P., & Qing, X. (2007). Multi-dielectric layer multi-patches microstrip antenna for UWB applications. In Proceedings of the 10th European Conference on Wireless Technology (pp. 261-263). [4403996] Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/ECWT.2007.4403996