Natural convection immersion cooling of discrete heat sources in a series of parallel interacting open-top cavities filled with a fluorinert liquid (FC-72) has been numerically studied. A series of open-top slots which are confined by conductive vertical walls with two heat sources on one side are considered. One of the slots is modeled and simulated. The effect of the separation between the heat sources on the flow and heat transfer characteristics of the wall and the effect of strength of the lower heat source (which location is upstream of the other one) on the flow and heat transfer of the upper heat source are considered. The wall thermal conductivity considered ranges from adiabatic to alumina-ceramic. The results of bakelite and alumina-ceramic are shown, which are commonly used as wiring boards in electronic equipment. It is found that conduction in the wall is very important and enhances the heat transfer performance.
|Number of pages||9|
|Journal||Journal of Electronic Packaging, Transactions of the ASME|
|Publication status||Published - Mar 1998|