Natural convection heat transfer from electronic components located in an enclosure

M. H. Esteki*, J. A. Reizes, M. Behnia

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

The problem of laminar natural convection cooling of electronic components located on a vertical substrate placed in a square enclosure filled with a fluid of Prandtl number equal to 0.71 corresponding to air is studied numerically. A commercially available general purpose CFD code, FLOW3D, was used to simulate the physical problem. Results have been obtained for a number of two dimensional geometries of realistic size conditions. The optional positions for the cooling of isothermal and constant heat flux plates are given.

Original languageEnglish
Pages (from-to)711-719
Number of pages9
JournalInternational Journal of Fluid Mechanics Research
Volume25
Issue number4-6
Publication statusPublished - 1998
Externally publishedYes

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