The paper describes a novel approach to solving heat transfer problems in geometrically complex systems. In the present approach, instead of simulating the detailed complex geometry, templates of components and devices are assumed rather than working on actual components. By varying the template dimensions a systematic study on the effects of geometrical configurations on cooling airflow and heat transfer is made possible. The application of the approach is illustrated drawing examples from cases of heat spreader designs and heat transfer analysis of portable computers. The purpose of the study is to develop a methodology whereby the packaging designer is freed from the task of performing detailed numerical analysis. Currently available numerical analysis tools such as computational fluid dynamics (CFD) codes are given a role in an undertaking to create databases from which fast design formulas are developed.
|Number of pages||8|
|Journal||Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference|
|Publication status||Published - 2000|