Abstract
The advantages of natural convection cooling have prompted many experimental and numerical investigations to determine the heat transfer performance of microelectronic components. In this study, we have performed two-dimensional numerical simulations for predicting the natural convection flow and heat transfer behavior of a vertical board of finite thermal conductivity with a number of protruding chips mounted on it. A series of parallel substrates open at the top and bottom are considered which allows the use of repeated boundary conditions. In order to validate the CFD code, the experimental results of Fujii et al (1996) are used and their geometry of a realistically sized board with 18 protruded chips is adopted. Simulations have been performed with various substrate thermal conductivity and channel widths. The chip power level has been varied in the range of a realistic chip temperature. The relationship between the induced flow rate and natural convection parameters is examined. The results indicate that conduction in the solid has an important effect on the flow and temperature fields in the fluid and strongly affects the heat transfer behavior.
Original language | English |
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Title of host publication | Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference |
Editors | Sushi1 H. Bhavnani, Gary B. Kromann, Douglas J. Nelson |
Place of Publication | Piscataway, N.J. |
Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
Pages | 135-142 |
Number of pages | 8 |
ISBN (Electronic) | 0780344774 |
ISBN (Print) | 0780344758, 0780344766 |
DOIs | |
Publication status | Published - May 1998 |
Externally published | Yes |
Event | Proceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM - Seattle, WA, USA Duration: 27 May 1998 → 30 May 1998 |
Other
Other | Proceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM |
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City | Seattle, WA, USA |
Period | 27/05/98 → 30/05/98 |