Numerical simulation of combined natural convection-conduction cooling of multiple protruding chips on a series of parallel substrates

Masud Behnia*, Wataru Nakayama

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contribution

6 Citations (Scopus)

Abstract

The advantages of natural convection cooling have prompted many experimental and numerical investigations to determine the heat transfer performance of microelectronic components. In this study, we have performed two-dimensional numerical simulations for predicting the natural convection flow and heat transfer behavior of a vertical board of finite thermal conductivity with a number of protruding chips mounted on it. A series of parallel substrates open at the top and bottom are considered which allows the use of repeated boundary conditions. In order to validate the CFD code, the experimental results of Fujii et al (1996) are used and their geometry of a realistically sized board with 18 protruded chips is adopted. Simulations have been performed with various substrate thermal conductivity and channel widths. The chip power level has been varied in the range of a realistic chip temperature. The relationship between the induced flow rate and natural convection parameters is examined. The results indicate that conduction in the solid has an important effect on the flow and temperature fields in the fluid and strongly affects the heat transfer behavior.

Original languageEnglish
Title of host publicationThermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
EditorsSushi1 H. Bhavnani, Gary B. Kromann, Douglas J. Nelson
Place of PublicationPiscataway, N.J.
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages135-142
Number of pages8
ISBN (Electronic)0780344774
ISBN (Print)0780344758, 0780344766
DOIs
Publication statusPublished - May 1998
Externally publishedYes
EventProceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM - Seattle, WA, USA
Duration: 27 May 199830 May 1998

Other

OtherProceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
CitySeattle, WA, USA
Period27/05/9830/05/98

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