On the design of broadband resonant cavity antennas with feeds suitable for integration with millimeter-wave transceiver chips

Raheel M. Hashmi, Affan A. Baba, Karu P. Esselle, Julio Gonzalez Marin, Jan Hesselbarth

Research output: Chapter in Book/Report/Conference proceedingConference proceeding contribution

Abstract

This paper demonstrates the resonant cavity antenna's (RCA) integration capability with the millimeter-wave (mm-wave) transceiver chips. A broadband RCA fed by a probe-fed microstrip patch, which is readily integrated with transceiver chips, is designed at 60 GHz. It exhibits a peak broadside gain of 19 dBi with a VSWR 2:1 bandwidth ranging from 57 GHz to beyond 70 GHz. Radiation performance of the RCA fed by a traditional waveguide aperture is also presented to demonstrate the feasibility of the proposed RCA in mm-wave practical applications.

Original languageEnglish
Title of host publicationProceedings of the 2019 International Conference on Electromagnetics in Advanced Applications (ICEAA)
Subtitle of host publicationICEAA '19 21st edition
Place of PublicationPiscataway, NJ
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages621-622
Number of pages2
ISBN (Electronic)9781728105635, 9781728105628
ISBN (Print)9781728105642
DOIs
Publication statusPublished - 2019
Event21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019 - Granada, Spain
Duration: 9 Sep 201913 Sep 2019

Conference

Conference21st International Conference on Electromagnetics in Advanced Applications, ICEAA 2019
CountrySpain
CityGranada
Period9/09/1913/09/19

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Hashmi, R. M., Baba, A. A., Esselle, K. P., Gonzalez Marin, J., & Hesselbarth, J. (2019). On the design of broadband resonant cavity antennas with feeds suitable for integration with millimeter-wave transceiver chips. In Proceedings of the 2019 International Conference on Electromagnetics in Advanced Applications (ICEAA): ICEAA '19 21st edition (pp. 621-622). Piscataway, NJ: Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/ICEAA.2019.8879156