Abstract
Payment arrangement is one of the vital issues in a B2B setting. For example, failing to accurately specify and communicate payment details such as the method of the payment, whether payment is refundable and negotiable, and what settlement model is used, can lead to serious disputes between the provider and requester of a service. However current development and solutions in service description, e.g., WSDL, do not cater for the specification and negotiation of payment related requirements for services. In this paper we present a comprehensive modeling approach for capturing and specifying payment requirements in the context of business collaboration. It will lay a foundation for service providers and requesters to explicitly define and adjust their business and technical requirements for payment in an adaptive and verifiable way. Furthermore, it provides support for terms of payment to be negotiated effectively to reach service provisioning agreements.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - 2008 IEEE International Conference on Services Computing, SCC 2008 |
| Place of Publication | Los Alamitos, CA |
| Publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| Pages | 137-144 |
| Number of pages | 8 |
| Volume | 1 |
| ISBN (Print) | 9780769532837 |
| DOIs | |
| Publication status | Published - 2008 |
| Event | 2008 IEEE International Conference on Services Computing, SCC 2008 - Honolulu, HI, United States Duration: 7 Jul 2008 → 11 Jul 2008 |
Other
| Other | 2008 IEEE International Conference on Services Computing, SCC 2008 |
|---|---|
| Country/Territory | United States |
| City | Honolulu, HI |
| Period | 7/07/08 → 11/07/08 |
Bibliographical note
Copyright 2008 IEEE. Reprinted from SCC 2008 : 2008 IEEE International Conference on Services Computing : proceedings, Honolulu, Hawaii, USA, July 8-11, 2008. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Macquarie University’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to [email protected]. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.Fingerprint
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